Machine for preparing glue diluent for electronic component manufacturing
A technology for electronic components and diluents, applied in mixers, mixer accessories, chemical instruments and methods, etc., can solve problems such as uneven, time-consuming and labor-intensive preparation of glue diluents
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0024] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part is equipped with a feeding hopper 6, the lower part of the feeding hopper 6 is located directly above the opening on the left side of the frame 2, the lower part o...
Embodiment 2
[0026] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part is equipped with a feeding hopper 6, the lower part of the feeding hopper 6 is located directly above the opening on the left side of the frame 2, the lower part o...
Embodiment 3
[0029] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part of the hopper 6 is installed, and the lower part of the hopper 6 is located directly above the opening on the left side of the frame 2. The lower part of the hoppe...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


