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Machine for preparing glue diluent for electronic component manufacturing

A technology for electronic components and diluents, applied in mixers, mixer accessories, chemical instruments and methods, etc., can solve problems such as uneven, time-consuming and labor-intensive preparation of glue diluents

Inactive Publication Date: 2018-12-04
廖淼帆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of manual preparation of glue thinner in the prior art, time-consuming and labor-intensive preparation, and uneven preparation of glue thinner, the technical problem to be solved is to provide a glue thinner that does not need to be prepared manually, saving time and effort. Glue thinner preparation machine for making uniform electronic components with glue thinner

Method used

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  • Machine for preparing glue diluent for electronic component manufacturing
  • Machine for preparing glue diluent for electronic component manufacturing
  • Machine for preparing glue diluent for electronic component manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part is equipped with a feeding hopper 6, the lower part of the feeding hopper 6 is located directly above the opening on the left side of the frame 2, the lower part o...

Embodiment 2

[0026] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part is equipped with a feeding hopper 6, the lower part of the feeding hopper 6 is located directly above the opening on the left side of the frame 2, the lower part o...

Embodiment 3

[0029] A glue thinner preparation machine for manufacturing electronic components, such as Figure 1-5 As shown, it includes a support seat 1, a frame body 2, a discharge pipe 3, a first valve 4, a fixed rod 5, a hopper 6, a second valve 7, a cylinder 8, a piston 9, a tie rod 10, and a liquid inlet pipe 11. One-way valve 12, first bearing seat 13, screw rod 14, first rotating rod 15, suction pipe 151 and sealing ring 152, the lower side of the frame 2 and the left and right parts are provided with support seats 1, frame 2 A discharge pipe 3 is connected to the left part of the lower wall. The discharge pipe 3 communicates with the left part of the lower wall of the frame body 2. A first valve 4 is provided on the discharge pipe 3, and a fixed rod 5 is fixedly connected to the top of the frame body 2. 5 The upper part of the hopper 6 is installed, and the lower part of the hopper 6 is located directly above the opening on the left side of the frame 2. The lower part of the hoppe...

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PUM

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Abstract

The invention relates to a diluent preparing machine, in particular, a machine for preparing a glue diluent for electronic component manufacturing. The provided machine has the advantages that the glue diluent is prepared without manual operation, time and labor are saved, and the prepared glue diluent is uniform. The provided machine comprises support seats, a frame, a discharge pipe, a first valve, a fixed rod, and a feed hopper. The left part and right part of the lower side of the frame are both provided with a support seat. The left part of the lower wall of the frame is connected to thedischarge pipe, and the discharge pipe is communicated with the left part of the lower wall of the frame and is provided with the first valve. The effects that the glue diluent is prepared without manual operation, time and labor are saved, and the prepared glue diluent is uniform are achieved. By setting a cross bar, a third bearing seat, a third rotation rod, a belt wheel, a flat belt, a doubleaxis motor, and a bevel gear, solid raw materials can be added intermittently and automatically.

Description

Technical field [0001] The invention relates to a diluent preparation machine, in particular to a glue diluent preparation machine for manufacturing electronic components. Background technique [0002] Electronic components are components of electronic components and small electric machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts in electrical appliances, radios, meters and other industries, such as capacitors and transistors. , Hairspring, clockwork and other sub-devices. Common ones are diodes and so on. [0003] In the existing glue diluent preparation technology, it is necessary to manually prepare the glue diluent manually, which will cost a lot of manpower and consume a long time, and the glue diluent prepared manually is not very uniform. Summary of the invention [0004] In order to overcome the shortcomings of manual preparation of glue diluent in the prior art, time-consuming and lab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F7/04B01F7/08B01F15/02
CPCB01F27/1143B01F27/1162B01F27/118B01F27/1921B01F27/72B01F27/70B01F35/332B01F35/75425B01F35/7547B01F2101/36
Inventor 廖淼帆
Owner 廖淼帆