A tool and adjustment method for adjusting the position of a detection sensor
A technology for detecting sensors and tools, which is applied in the field of sensor detection, can solve the problems of low adjustment accuracy, abnormal detection wafer thickness, and data deviation, etc., and achieve the effect of improving work efficiency and quality, and easy operation
Active Publication Date: 2020-08-25
WUHAN XINXIN SEMICON MFG CO LTD
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Problems solved by technology
[0002] In the field of semiconductor technology, the detection process machines use infrared through-beam sensors to detect the state of the wafers in the wafer box, where the wafer state includes detecting the thickness and position of the wafer; due to the long-term mechanical The position of the detection arm of the detection sensor is shifted due to transmission, cylinder wear and other reasons, which causes the thickness or position of the wafer detected by the detection sensor to be abnormal. We need to adjust the horizontal position and vertical position of the probe of the detection sensor and the corresponding machine.
[0003] The current adjustment method is to use a square to measure the height of the two probes relative to the machine table. Because the reference positions of the reference level are inconsistent, the measured data has deviations, which makes the adjustment accuracy not high and requires multiple adjustments, reducing the work efficiency
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[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0041] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0042] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0043] The invention includes a tool for adjusting the position of the detection sensor, which is suitable for d...
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The invention includes a tool and an adjustment method for adjusting the position of a detection sensor, which is suitable for detecting the thickness and position of a wafer by a detection sensor in a detection process machine. The detection sensor includes a light emitting end and a light receiving end, including: a bracket fixed on On the detection process machine, the support includes a 匚-shaped part, and the 匚-shaped part has an upper beam, a lower beam and a vertical connecting rod; a fixed scale, which is perpendicular to the upper beam and perpendicular to the vertical connecting rod, is connected to the upper beam; a floating scale , which is perpendicular to the upper beam and perpendicular to the vertical connecting rod, is connected to the upper beam, and is located on the same side as the fixed scale; First gap. The beneficial effect is that the horizontal and vertical positions of the light emitting end and the light receiving end of the detection sensor can be quickly and accurately adjusted, and the adjustment is completed at one time, the operation is simple, and the work efficiency and quality are effectively improved.
Description
technical field [0001] The invention relates to the technical field of sensor detection, in particular to a tool and an adjustment method for adjusting the position of a detection sensor. Background technique [0002] In the field of semiconductor technology, the detection process machines use infrared through-beam sensors to detect the state of the wafers in the wafer box, where the wafer state includes detecting the thickness and position of the wafer; due to the long-term mechanical The position of the detection arm of the detection sensor is shifted due to transmission, cylinder wear and other reasons, which will cause the abnormal thickness or position of the wafer detected by the detection sensor. We need to adjust the horizontal position and vertical position of the probe of the detection sensor and the corresponding machine. . [0003] The current adjustment method is to use a square to measure the height of the two probes relative to the machine table. Because the ...
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IPC IPC(8): G01B11/06G01B11/00
CPCG01B11/00G01B11/06
Inventor 管武能
Owner WUHAN XINXIN SEMICON MFG CO LTD