Panel and fitting method thereof
A panel and bonding technology, applied in optics, instruments, electrical digital data processing, etc., can solve problems such as complex bonding process, high bonding cost, and high control difficulty, so as to reduce the probability of MURA phenomenon, save labor costs, The effect of simple laminating process
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[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0029] Please refer to figure 1 and figure 2 , an embodiment of the present inven...
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