PCH module disassembly method

A PCB board, disassembly and connection technology, applied in the server field, can solve the problems of low disassembly efficiency and long heating time, and achieve the effect of reducing the heat loss speed, shortening the heating time, and avoiding damage

Inactive Publication Date: 2018-12-11
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this disassembly method requires longer heating time and lower disassembly efficiency

Method used

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] The core of the present invention is to provide a PCH module disassembly method with high disassembly efficiency.

[0035] In a specific embodiment of the PCH disassembly method provided by the present invention, please refer to Figure 4 , including the following steps:

[0036] Step S1: Take off the heat dissipation cover 1 fixed on the PCB board 2 of the PCH module. Wherein, the heat dissipation cover 1 is usually tightly pasted on the PCB board 2 ...

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Abstract

The invention discloses a PCH module disassembly method, which comprises the following steps: removing a heat dissipation cover fixed on a PCB board of the PCH module; Heat the BGA pad at the bottom of the PCH module to melt the solder to remove the PCH module from the motherboard. In this disassembly method, adding the process of removing the heat dissipation cover in the PCH module before removing the PCH module, After removing the heat dissipation cover, the PCH module is removed, so as to reduce the heat dissipation speed when heating the BGA pad and the heat loss speed when heating, so that the melting point temperature of the solder can be quickly reached at the BGA pad, the heating time is shortened, and the damage to the main board caused by long-time heating can be avoided.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a method for disassembling a PCH module. Background technique [0002] When performing a mainboard power supply test, sometimes due to test requirements or board failures, it is necessary to remove the PCH module (Platform Controller Hub, platform controller hub) on the mainboard. The PCH module is usually packaged in a BGA (Ball Grid Array, ball grid array, a packaging technology for surface mount devices). In order to enhance heat dissipation, the PCH module itself has a metal heat dissipation cover, and a heat sink is added to the outside of the PCH module. [0003] At present, when disassembling the PCH module, a typical method is to directly heat the PCH module after removing the external heat sink to melt the solder on the BGA pad at the bottom of the PCH module. However, this disassembly method requires longer heating time and lower disassembly efficiency. [0004] Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCH05K3/225
Inventor 齐雪宝
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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