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Electronic component shell injection molding device

A technology for electronic components and casings, which is applied in the field of injection molding devices for electronic components casings, can solve problems such as waste of labor and complicated use, and achieve the effect of speeding up the work process and saving manpower

Inactive Publication Date: 2018-12-14
吴浩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of complex use of plastic products, waste of a lot of labor, and a lot of time, the technical problem to be solved is to provide an electronic component shell injection molding device that can replace manual labor, save time, and is easy to use.

Method used

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  • Electronic component shell injection molding device
  • Electronic component shell injection molding device
  • Electronic component shell injection molding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An injection molding device for an electronic component shell, such as Figure 1-6 As shown, it includes a base 1, a first support rod 2, a second support rod 3, a lower mold 4, a first one-way valve 5, a discharge pipe 6, a second one-way valve 7, a feed pipe 8, and a piston 9 , the cylinder block 10, the first spring 11, the lifting rod 12, the connecting plate 13 and the upper mold 41, the upper part of the base 1 is sequentially installed with the second supporting rod 3 and the first supporting rod 2 from left to right, and the upper part of the second supporting rod 3 The lower mold 4 is installed, the upper mold 41 is placed on the upper part of the lower mold 4, the cylinder body 10 is installed on the top of the first support rod 2, the discharge pipe 6 is installed on the left side of the cylinder body 10, and the first unit is installed in the discharge pipe 6. Directional valve 5, the left end of the discharge pipe 6 is connected to the lower mold 4, the rig...

Embodiment 2

[0029] An injection molding device for an electronic component shell, such as Figure 1-6As shown, it includes a base 1, a first support rod 2, a second support rod 3, a lower mold 4, a first one-way valve 5, a discharge pipe 6, a second one-way valve 7, a feed pipe 8, and a piston 9 , the cylinder block 10, the first spring 11, the lifting rod 12, the connecting plate 13 and the upper mold 41, the upper part of the base 1 is sequentially installed with the second supporting rod 3 and the first supporting rod 2 from left to right, and the upper part of the second supporting rod 3 The lower mold 4 is installed, the upper mold 41 is placed on the upper part of the lower mold 4, the cylinder body 10 is installed on the top of the first support rod 2, the discharge pipe 6 is installed on the left side of the cylinder body 10, and the first unit is installed in the discharge pipe 6. Directional valve 5, the left end of the discharge pipe 6 is connected to the lower mold 4, the righ...

Embodiment 3

[0032] An injection molding device for an electronic component shell, such as Figure 1-6 As shown, it includes a base 1, a first support rod 2, a second support rod 3, a lower mold 4, a first one-way valve 5, a discharge pipe 6, a second one-way valve 7, a feed pipe 8, and a piston 9 , the cylinder block 10, the first spring 11, the lifting rod 12, the connecting plate 13 and the upper mold 41, the upper part of the base 1 is sequentially installed with the second supporting rod 3 and the first supporting rod 2 from left to right, and the upper part of the second supporting rod 3 The lower mold 4 is installed, the upper mold 41 is placed on the upper part of the lower mold 4, the cylinder body 10 is installed on the top of the first support rod 2, the discharge pipe 6 is installed on the left side of the cylinder body 10, and the first unit is installed in the discharge pipe 6. Directional valve 5, the left end of the discharge pipe 6 is connected to the lower mold 4, the rig...

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Abstract

The Invention relates to injection molding devices, and in particular relates to an electronic component shell injection molding device. The invention solves the technical problem of providing the electronic component shell injection molding device which can replace the manual labor, can save the time, and is convenient to use. The electronic component shell injection molding device adopts the following technical scheme of comprising a base, a first supporting rod, a second supporting rod, a lower mold, a first check valve, a discharging pipe, a second check valve, and a feeding pipe, whereinthe second supporting rod and first supporting rod are arranged in sequence from left to right on the upper part of the base; the lower mold is arranged on the upper part of the second supporting rod;the upper mold is arranged on the upper part of the lower mold; and a cylinder body is arranged on the upper part of the first supporting rod. The electronic component shell injection molding devicecan achieve the effects of replacing the manual labor, saving the time and being convenient to use. By using the device disclosed by the invention, the manufacture of a plurality of plastic shells canbe quickly completed, a plenty of time of workers is saved, the service life of the manufactured plastic shells is prolonged, the economic benefits of a factory are improved, and the device is rigorous in structure and long in service life.

Description

technical field [0001] The invention relates to an injection molding device, in particular to an injection molding device for electronic component shells. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as hairsprings, hairsprings, etc., common ones include diodes, etc. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, relays, printed circuit boards, ...

Claims

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Application Information

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IPC IPC(8): B29C45/00B29C45/17B29C45/53B29C45/26B29L31/34
CPCB29C45/00B29C45/17B29C45/26B29C45/53B29L2031/34
Inventor 吴浩
Owner 吴浩
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