An automatic conveying apparatus for a semiconductor substrate
A handling equipment and semiconductor technology, applied in the field of automatic handling equipment for semiconductor substrate feeding, can solve problems such as placement angle deviation, disrupting the market fair competition environment, substrate damage, etc., to improve flexibility and directionality, improve work efficiency and Resource utilization and the effect of avoiding substrate damage
Active Publication Date: 2018-12-21
浙江雅市晶科技有限公司
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Problems solved by technology
[0002] At present, my country's semiconductor equipment is highly dependent on the United States, and the escalation of friction will destroy the fair competition environment in the market, which is not conducive to the development of the domestic electronics industry. At the same time, this will bring development opportunities to China's semiconductor equipment industry, but the existing production equipment is transported in the semiconductor substrate. During the process, the suction cup is often unable to firmly hold the substrate due to the deviation of the placement angle of the semiconductor substrate, which may easily cause damage to the substrate
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] The present invention provides such Figure 1-3 The shown automatic handling equipment for semiconductor substrate feeding includes a column 1, a crossbar 2 is provided on one side of the column 1, a first spring 3 is provided on one side of the crossbar 2, and a first spring 3 is provided on one side of the column 1. One end is fixedly connected with the cross bar 2, the other end of the first spring 3 is provided with a balance plate 4, one side of th...
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The invention discloses an automatic conveying device for a semiconductor substrate, including a vertical column, A cross bar is arranged on one side of that upright post, A first spring is arranged on one side of the cross bar, One end of the first spring is fixedly connected with the cross bar, the other end of the first spring is provided with a balancing plate, one side of the balancing plateis provided with a fixing block, one side of the fixing block is provided with a suction disk, and both sides of the suction disk are provided with second springs, one end of the second spring is fixedly connected with the suction disk, and the other end of the second spring is fixedly connected with the balancing plate. A suction disk is provided with a second spring on one side, an electric telescopic rod is elongated, At the same time, the step motor works to drive the gear disk to rotate, the rotation of the gear disk drives the rotation of the connecting member, the rotation of the connecting member drives the vertical column to move to one side, when the suction disk on one side of the vertical column contacts the substrate, the suction disk moves to one side to drive the second spring to compress due to the existence of the interaction force, and the surface of the suction disk is tightly adhered to the surface of the substrate due to the restoration deformation of the second spring.
Description
technical field [0001] The invention relates to the technical field of automatic conveyance, in particular to an automatic conveyance device for feeding semiconductor substrates. Background technique [0002] At present, my country's semiconductor equipment is highly dependent on the United States, and the escalation of friction will destroy the fair competition environment in the market, which is not conducive to the development of the domestic electronics industry. At the same time, this will bring development opportunities to China's semiconductor equipment industry, but the existing production equipment is transported in the semiconductor substrate. During the process, the suction cup is often unable to firmly hold the substrate due to the deviation of the placement angle of the semiconductor substrate, which easily causes damage to the substrate. [0003] Therefore, it is necessary to invent an automatic handling equipment for semiconductor substrate feeding to solve the...
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IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67796H01L21/6838
Inventor 沈良霖
Owner 浙江雅市晶科技有限公司