Automatic handling equipment for semiconductor substrate feeding
A technology for handling equipment and semiconductors, which is applied in the field of automatic handling equipment for semiconductor substrate feeding. It can solve problems such as disrupting the fair competition environment in the market, placing angle deviations, and substrate damage, so as to improve work efficiency, resource utilization, and flexibility. and directionality, to avoid damage to the substrate
Active Publication Date: 2021-08-17
浙江雅市晶科技有限公司
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Problems solved by technology
[0002] At present, my country's semiconductor equipment is highly dependent on the United States, and the escalation of friction will destroy the fair competition environment in the market, which is not conducive to the development of the domestic electronics industry. At the same time, this will bring development opportunities to China's semiconductor equipment industry, but the existing production equipment is transported in the semiconductor substrate. During the process, the suction cup is often unable to firmly hold the substrate due to the deviation of the placement angle of the semiconductor substrate, which may easily cause damage to the substrate
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] The present invention provides such Figure 1-3 The shown automatic handling equipment for semiconductor substrate feeding includes a column 1, a crossbar 2 is provided on one side of the column 1, a first spring 3 is provided on one side of the crossbar 2, and a first spring 3 is provided on one side of the column 1. One end is fixedly connected with the cross bar 2, the other end of the first spring 3 is provided with a balance plate 4, one side of th...
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The invention discloses an automatic material handling equipment for semiconductor substrates, which comprises a column, one side of the column is provided with a crossbar, one side of the crossbar is provided with a first spring, and one end of the first spring is fixed to the crossbar connection, the other end of the first spring is provided with a balance plate, one side of the balance plate is provided with a fixed block, one side of the fixed block is provided with a suction cup, and both sides of the suction cup are provided with a second spring, and the first One end of the second spring is fixedly connected with the sucker, and the other end of the second spring is fixedly connected with the balance plate. In the present invention, a second spring is provided on one side of the suction cup to extend the electric telescopic rod. At the same time, the stepping motor works to drive the gear plate to rotate, and the rotation of the gear plate drives the connecting piece to rotate. When the suction cup touches the substrate, due to the existence of the interaction force, the suction cup moves to one side to drive the second spring to compress, and the second spring recovers and deforms to make the surface of the suction cup close to the surface of the substrate.
Description
technical field [0001] The invention relates to the technical field of automatic conveyance, in particular to an automatic conveyance device for feeding semiconductor substrates. Background technique [0002] At present, my country's semiconductor equipment is highly dependent on the United States, and the escalation of friction will destroy the fair competition environment in the market, which is not conducive to the development of the domestic electronics industry. At the same time, this will bring development opportunities to China's semiconductor equipment industry, but the existing production equipment is transported in the semiconductor substrate. During the process, the suction cup is often unable to firmly hold the substrate due to the deviation of the placement angle of the semiconductor substrate, which easily causes damage to the substrate. [0003] Therefore, it is necessary to invent an automatic handling equipment for semiconductor substrate feeding to solve the...
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IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67796H01L21/6838
Inventor 沈良霖
Owner 浙江雅市晶科技有限公司