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Electronic package and manufacturing method thereof

A technology for electronic packaging and electronic components, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems that the first electronic component 21 cannot operate normally, damage the first electronic component 21, etc., and achieves The effect of maintaining consistency and reducing process cost

Active Publication Date: 2018-12-25
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] However, when the existing electronic package 2 is in operation, the first electronic component 21 located between the first and second circuit structures 20, 26 is very sensitive to external electromagnetic waves, which will not only make the first electronic component 21 unable to operate normally. operation, and external electromagnetic waves may also damage the first electronic component 21

Method used

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  • Electronic package and manufacturing method thereof
  • Electronic package and manufacturing method thereof
  • Electronic package and manufacturing method thereof

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Embodiment Construction

[0081] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0082] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...

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Abstract

An electronic package and a manufacturing method thereof are provided. An electronic component and a plurality of conductive pillars and support members of different heights are disposed on a first circuit structure, blocks are disposed on the support members, and then a covering layer covering the electronic component, the blocks, the support members and the conductive pillars are formed such that the outer periphery of the electronic component is covered with the blocks and the support members, so that the electronic component is protected from external electromagnetic interference when theelectronic package is operated.

Description

technical field [0001] The invention relates to a packaging technology, in particular to a semiconductor package that avoids electromagnetic interference and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. In order to meet the needs of miniaturization of electronic products and electronic packages installed therein, the technology of chip scale package (Chip Scale Package, CSP) has been developed, which is characterized in that this kind of chip scale package only has the Equal size or slightly larger size. [0003] Figure 1A to Figure 1E It is a schematic cross-sectional view of the manufacturing method of the conventional chip size package 1 . [0004] like Figure 1A As shown, a thermal release tape 100 is formed on a carrier 10 . [0005] Next, place a plurality of semiconductor elements 11 on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/498H01L21/56
CPCH01L23/49811H01L21/561H01L23/3121H01L2924/15311H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 廖俊明江政嘉王隆源王愉博
Owner SILICONWARE PRECISION IND CO LTD