Method for filling through hole by electroplating and container used therein
A technology of container and electroplating solution, applied in the direction of plating tank, electrical components, printed circuit, etc., can solve the problem that the inner wall of through hole cannot be electroplated
Inactive Publication Date: 2018-12-28
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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- Description
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Problems solved by technology
Based on this, the present invention overcomes the defects of the prior art and provides a method for electroplating and filling a through hole and a container used in the method to solve the problem that the inner wall of the through hole cannot be electroplated
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The invention relates to a method for filling a through hole by electroplating and a container used in the method. The method for filling the through hole by the electroplating comprises the followingsteps: S100, slantwise placing PCB into the container accommodating an electroplating solution, and making an axis of the through hole on PCB inclined; S200, filling the through hole on PCB by the electroplating in the flowing electroplating solution; slantwise placing PCB into the container accommodating the electroplating solution to make the axis of the through hole inclined, thereby forming apressure difference between two sides of the through hole, and then sequentially exhausting gas in the through hole from the high-pressure side to the low-pressure side. The gas exhaust method can effectively exhaust the gas in the through hole to solve the problem of incapability of electroplating the inner wall of the through hole caused by residual gas in the through hole; the hole is filled by the electroplating for PCB in the flowing electroplating solution, so that metal ions in the electroplating solution can be promoted to flow to ensure the effectiveness of the electroplating.
Description
Technical field The present invention relates to the technical field of PCB electroplating hole filling, in particular to a method for electroplating through hole filling and a container used in the method. Background technique In recent years, with the increase in PCB wiring density, the diameter of through holes has decreased, and the thickness of PCB has increased. In the conventional wet process electroplating to fill the through holes, there is a problem that the inner wall of the through hole cannot be plated with copper, so that the yield rate of the PCB decreases. This phenomenon becomes more obvious and protruding as the ratio of the board thickness of the PCB to the aperture ratio of the through hole increases. Summary of the invention Based on this, the present invention overcomes the defects of the prior art and provides a method for filling through holes by electroplating and a container used in the method to solve the problem that the inner walls of through hole...
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IPC IPC(8): C25D17/02H05K3/42
CPCC25D17/02H05K3/424
Inventor 罗畅陈黎阳
Owner GUANGZHOU FASTPRINT CIRCUIT TECH