Unlock instant, AI-driven research and patent intelligence for your innovation.

Cutting device for chips

A cutting device and chip technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problem of low cutting efficiency of integrated boards, achieve the effects of reducing manual labor, ensuring cutting effects, and improving cutting efficiency

Active Publication Date: 2021-07-30
泸州龙芯微科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention intends to provide a cutting device for chips to solve the problem in the prior art that the position of the integrated board needs to be manually adjusted to adapt to different cutting methods, resulting in low cutting efficiency of the integrated board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cutting device for chips
  • Cutting device for chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following is further described in detail through specific implementation methods:

[0020] The reference signs in the drawings of the description include: fixed column 1, crank 11, vertical cutter 12, connecting rod 13, air suction hole 14, vertical groove 15, cross cutter 16, pull rod 17, air chamber 18, second Spring 19, belt 20, cutting table 21, upper half ring 22, runner 23, pole 24, rotating shaft 25, lower half ring 26, limit plate 27, transmission member 28, large gear 29, pinion 30, Rack 31, piston 32, driving rod 33, cylinder 34, first spring 35.

[0021] Such as figure 1 As shown, the cutting device for chips includes a frame, and a cutting table 21 is installed on the frame, combined with figure 2 It can be seen that a cylinder 34 is installed on the rear side of the cutting table 21, and for example figure 1 As shown, a drive mechanism is installed on the right side of the cutting table 21, the drive mechanism includes a rotating shaft 25, and the r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of electrical component processing, in particular to a cutting device for chips, including a frame, a cutting table is arranged on the frame, a driving mechanism is arranged on one side of the cutting table, a fixed column is arranged at one end of the cutting table, and a fixed column A crank is arranged on the side, one end of the crank is hinged on the fixed column, the other end of the crank is hinged with a connecting rod, the connecting rod is connected with the driving mechanism, the free end of the connecting rod is provided with a cross-cutting knife, and the cutting table is provided with a cross-cutting groove, which can be used for cross-cutting The knife is slidably connected in the cross-cutting groove, and the crank and the connecting rod are all provided with some vertical cutting knives, and the crank and the connecting rod are all perpendicular to the vertical cutting knives, and the cutting table is provided with some vertical cutting grooves for inserting the vertical cutting knives. The invention solves the problem in the prior art that the position of the integrated board needs to be manually adjusted to adapt to different cutting methods, resulting in low cutting efficiency of the integrated board.

Description

technical field [0001] The invention relates to the technical field of electrical component processing, in particular to a chip cutting device. Background technique [0002] Semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. [0003] In the process of semiconductor processing, enterprises integrate multiple semiconductor chips on a thin substrate, hereinafter referred to as integrated board, and cut them after the production is completed. The chips on the integrated board are distrib...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092
Inventor 黄晓波
Owner 泸州龙芯微科技有限公司