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A reusable shape memory alloy spacecraft landing buffer

A memory alloy, nickel-titanium memory alloy technology, applied in shock absorbers, shock absorbers, elastic shock absorbers, etc., can solve the problems of difficult to achieve automatic reset, unable to reuse, difficult to replace or maintain buffer devices, etc. Simple structure, easy processing and installation, high dissipation capacity

Active Publication Date: 2021-06-11
BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the landing process of a spacecraft, it is necessary to use a buffer device to reduce the impact on the internal personnel and loads, and the traditional buffer device usually uses the plastic deformation caused by the buckling of the aluminum honeycomb compression to buffer energy consumption, but the aluminum honeycomb compression occurs buckling Difficult to achieve automatic reset after that, and cannot be reused
Taking into account both benefits and costs, it is necessary to launch multiple personnel and materials in one flight mission. For this reason, the spacecraft needs to be able to perform multiple soft landings. However, it is difficult to replace or maintain traditional buffer devices in deep space environments such as the moon. Meet the requirements of the flight mission

Method used

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  • A reusable shape memory alloy spacecraft landing buffer
  • A reusable shape memory alloy spacecraft landing buffer
  • A reusable shape memory alloy spacecraft landing buffer

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Experimental program
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Embodiment

[0029] A reusable shape memory alloy spacecraft landing buffer, a single layer wavy buffer structure figure 1 As shown, the single layer wavy buffer structure is pressed by the mold and the type of a single layer wavy buffer structure is performed by heat treatment, so that it is wavy.

[0030] Connecting two single-layer wavy buffers, making the lowest point of the upper wavy single layer buffer structure with the highest point of the lower single layer wavy buffer structure, forming a double wavy buffer structure, such as figure 2 Indicated.

[0031] The pore block-shaped memory alloy structure formed after the above method is carried out in the above method; the pore block shape memory alloy structure is mounted between two planes that need to be buffered, form a buffer, such as image 3 As shown, during the landing buffer, relatively movement occurs between the two planes, the pore block shape memory alloy structure is compressed, such as Figure 4 As shown, the phase change pro...

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Abstract

A reusable shape memory alloy spacecraft landing buffer, which adopts a porous block shape memory alloy structure bonded by multi-layer wave buffer structure, uses the phase transition process of shape memory alloy material in the deformation process to dissipate energy, Realize the effect of buffering and absorbing energy, and at the same time use the memory effect of the shape memory alloy material on the original shape, and make it return to the original shape by heating, so as to realize the reusable use of the buffer.

Description

Technical field [0001] The present invention relates to a reusable shape memory alloy spacecraft landing buffer belonging to the field of spacecraft landing buffer technology. Background technique [0002] During the spacecraft, the buffer is required to reduce the impact on the internal person and load, while the conventional buffer device typically uses the shaped deformation produced by the buckling of the buckling of aluminum cellular compression, but aluminum honeycomb compression bucks. It is difficult to achieve automatic reset without reuse. Equalizing the benefits and costs, in one flight task needs to carry out multiple people and materials, for this purpose, the spacecraft can be able to make multiple soft landings, and it is difficult to replace or maintain the traditional buffer device in a deep-air environment such as moon. Meet the requirements of flight missions. Inventive content [0003] The technical problem to be solved by the present invention is to overcome...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16F7/12
CPCF16F7/128
Inventor 龙龙王永滨王立武梁浩武士轻朱谦冯蕊霍东阳刘欢刘媛媛
Owner BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH