Solid heat energy storage system with multiloop connectors
A thermal energy storage and multi-circuit technology, applied in heating systems, indirect heat exchangers, heating methods, etc., can solve problems such as insufficient heating capacity of the heating network, limited electricity consumption of thermal power plants, etc., to improve heat release adaptation performance, improve the effect of storage capacity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] This example figure 1 As shown, it is a single-structure solid thermal energy storage system with a double-set heat storage loop and a double-set heat release loop interface; figure 2 As shown, it is a multi-group structure solid thermal energy storage system with double-set heat storage loops and double-set heat release loop interfaces. They include: multi-heat source system 1, pipeline 2, multi-heat exchange system 3, solid energy storage body 4, Valve group 5, variable frequency drive, control device 7, heat user 8, bypass valve 9, heat carrier 10, heat preservation layer 11, metal plate 12, heat release variable frequency drive 13, heat release output end 14, heat release return end 15, Heat exchange input end 16, heat exchange return end 17, dredging cavity 18, heat carrier constant pressure supplementary device 19.
[0022] Such as figure 1 The solid energy storage body 4 shown is a high temperature resistant building block body with an insulation layer 11 on t...
Embodiment 2
[0026] Such as figure 2 As shown, in addition to the heat carrier pipes in the solid energy storage body 4, the heat storage and heat release circuits adopt a multi-group structure in which parallel arrays are distributed and installed. figure 1 Heat carrier constant pressure supplementary device 19 is provided in more. The heat carrier constant pressure supplementary device 19, the heat exchange return end 17, and the exothermic frequency conversion drive 13 are connected by a pipeline 2. The purpose is to establish a stable heat release working condition through the heat carrier constant pressure supplementary device 19 arranged at the pump tail of the thermal variable frequency drive 13 . The working process is no longer described in detail.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com