Chip-on-chip film substrate, display panel and manufacturing method thereof, and display device

A chip-on-chip film and display panel technology, which is applied to instruments, semiconductor devices, circuits, etc., can solve problems such as complex processes and low production efficiency

Active Publication Date: 2021-09-03
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the process is complicated and the production efficiency is low

Method used

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  • Chip-on-chip film substrate, display panel and manufacturing method thereof, and display device
  • Chip-on-chip film substrate, display panel and manufacturing method thereof, and display device
  • Chip-on-chip film substrate, display panel and manufacturing method thereof, and display device

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Embodiment Construction

[0032] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0033] In one aspect of the present invention, the present invention provides a chip-on-film substrate. According to an embodiment of the present invention, refer to figure 1, the edge of the chip-on-film substrate 200 has a cutting mark 210 , and the cutting mark 210 defines a trench area 220 at the edge of the chip-on-film substrate 200 . Before the chip-on-film substrate is fixed to the display module and forms the display panel, no grooves are pre-formed, thus avoiding the problem...

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Abstract

The invention discloses a chip-on-chip film substrate, a display panel, a preparation method thereof, and a display device. According to an embodiment of the present invention, the edge of the chip-on-film substrate has a cutting mark, and the cutting mark defines a groove area on the edge of the chip-on-film substrate. Therefore, when using the chip-on-chip film substrate to form a display panel, the chip-on-chip film substrate can be fixed on the substrate of the display module only by one alignment, the process is simple, and the production efficiency is high; and the alignment accuracy is high, avoiding It solves the dislocation problem caused by warped corners of the groove area during the alignment process, improves the product yield, and reduces the risk of defective products.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a chip-on-film substrate, a display panel, a preparation method thereof, and a display device. Background technique [0002] With the advent of the "full screen" era, high screen-to-body ratio display devices are favored by consumers, which poses new challenges to the structural design of display panels. At present, due to the limitation of the Gate on Array (GOA) drive unit, the left and right frame design of the full-screen display panel has reached the technological limit, but the upper and lower frame design of the display panel still has a lot of room for development. With the design of upper and lower narrow borders, COF (Chip on flexible printed circuit) process gradually replaces the traditional COG (Chip on glass) process and becomes the development direction of future display panels. Specifically, the traditional COG process is to place the chip directly ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333H01L23/544
CPCG02F1/1333G02F1/133351H01L23/544H01L2223/54426
Inventor 韩帅王跃林徐敬义张慧杰郭智昂石天雷
Owner BOE TECH GRP CO LTD
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