A kind of dip welding diamond wire and its manufacturing method
A manufacturing method and technology of diamond wire, applied in the direction of manufacturing tools, metal processing equipment, grinding devices, etc., can solve the problems of applying strong cutting force, long time, agglomeration, etc., and achieve reduction of environmental pollution, simple manufacturing process, and high production efficiency. low cost effect
Active Publication Date: 2021-04-06
SUZHOU YOURBEST NEW TYPE MATERIALS
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Problems solved by technology
The diamond abrasive grains in the lodging state cannot exert a strong cutting force on the workpiece, which greatly affects the cutting efficiency of the diamond wire
Moreover, the scraping effect is likely to cause uneven distribution of diamond abrasive grains, resulting in agglomeration, and the cutting stability of diamond wire is poor.
Method used
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[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0047] In order to achieve the purpose of the present invention, as figure 2 As shown, an embodiment of the present invention is: a kind of dipped diamond wire, comprising a metal core wire 1, a solder layer 2 and diamond abrasive grains 3, the solder layer 2 is coated on the outer surface of the metal core wire 1, and the diamond abrasive grain Part of the body of the grain 3 is embedded in the solder layer 2, and the part of the diamond abrasive grain 3 exposed ...
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Abstract
The invention provides a solder dipped diamond wire and a manufacturing method thereof. The solder dipped diamond wire includes a metal core wire, a solder layer and diamond abrasive grains, the solder layer is coated on the outer surface of the metal core wire, and the diamond abrasive grains A part of the body is embedded in the solder layer, and the part of the diamond abrasive grain exposed to the solder layer has an angular structure, and the tip of the angular structure is arranged radially outward along the diamond wire. Compared with the prior art, the present invention adopts the solder layer to attach the diamond abrasive grains, the manufacturing process is simple, the production cost is low, and the environmental pollution is reduced. The diamond abrasive grains are evenly distributed and the exposed part has an angular structure, which is not easy to fall off during the cutting process and has a long service life. Long, high cutting efficiency.
Description
technical field [0001] The invention relates to the cutting and processing of hard and brittle materials such as silicon crystals and gemstones, as well as the technical fields of abrasives and abrasive tools, and in particular relates to a dipped and welded diamond wire and a manufacturing method thereof. Background technique [0002] Diamond wire is a sawing tool made by consolidating diamond abrasive grains on the surface of the steel wire through a certain process. After the polyhedral diamond abrasive grains are consolidated on the surface of the steel wire, under the protection of the diamond abrasive grains, the steel wire It is not in direct contact with the workpiece and is not easy to be damaged, which can greatly improve the service life, cutting efficiency and precision of the steel wire. At present, the mainstream diamond wires in the photovoltaic industry mainly include electroplated diamond wires and resin diamond wires. In the production process of electropl...
Claims
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IPC IPC(8): B28D5/04B24B27/06B24D18/00B21C37/04
CPCB21C37/042B21C37/045B24B27/0633B24D18/0054B28D5/045
Inventor 肖锋朱骄峰
Owner SUZHOU YOURBEST NEW TYPE MATERIALS