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Heat dissipation device

A technology of a heat sink and a box body is applied in the field of computers, which can solve the problems of not being able to solve the heat dissipation of batch computers, reducing the service life of computers, affecting the operation of computers, etc., and achieving the effects of strong structure, improved service life and convenient operation.

Active Publication Date: 2019-01-18
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Computers are composed of hardware systems and software systems. Computers without any software installed are called bare metal. They can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. Computers generate a large amount of power during work. If the batch computers are used together, a large amount of heat will be emitted. If the heat cannot be dissipated, it will affect the operation of the host computer and reduce the service life of the computer. The traditional heat dissipation device is for a single cooling of the computer host computer, which cannot solve the heat dissipation of batch computers, and the heat dissipation speed is relatively fast. Slow, affecting computer operation

Method used

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Embodiment Construction

[0030] An embodiment of the present application provides a heat dissipation device, which is used to suck out heat from multiple computers at the same time, so as to dissipate heat from the computers and improve the service life of the computers.

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be described below in conjunction with the drawings in the embodiment of the application. Obviously, the described embodiment is only a part of the application Examples, but not all examples. Based on the embodiments in this application, all should belong to the protection scope of this application.

[0032] Such as figure 1 as shown, figure 1 It is a schematic diagram of an embodiment of a heat dissipation device in an embodiment of the present invention. Can include:

[0033] The first box 1, the horizontal plate 2, the switch 3, the suction fan 4, the...

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Abstract

The embodiment of the present application discloses a heat dissipation device, which is used for absorbing heat in a plurality of counting machines, so that the computer dissipates heat and prolongs the service life of the computer. A device in embodiment of that present application includes: A first housing (1), Horizontal plate (2), Switch (3), A suction fan (4), the exhaust pipe (5), An L-shaped tube (6), Connecting pipe (8), A second housing (9), A first through hole (10), a first filter screen(11), a first vertical rod(13), a vibrator (14), a second vertical rod (21), a second hose(22), amotor (27), a blade(28), a connecting rod (29), a second barrel (30), a second slider (31), a cross rod (32), a reduction motor (33), a cross pipe (34), a piston (35), a second through hole (37), a second filter screen (38), a third hose (39), and a third filter screen (40).

Description

technical field [0001] The invention relates to the field of computers, in particular to a cooling device. Background technique [0002] Computers are composed of hardware systems and software systems. Computers without any software installed are called bare metal. They can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. Computers generate a large amount of power during work. If the batch computers are used together, a large amount of heat will be emitted. If the heat cannot be dissipated, it will affect the operation of the host computer and reduce the service life of the computer. The traditional heat dissipation device is for a single cooling of the computer host computer, which cannot solve the heat dissipation of batch computers, and the heat dissipation speed is relatively fast. Slow, affecting computer operation. Contents of the invention [0003] An embodiment of the pres...

Claims

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Application Information

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IPC IPC(8): G06F1/20B08B1/00
CPCG06F1/20B08B1/30B08B1/12
Inventor 李成霖
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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