Heat dissipation device
A technology of a heat sink and a box body is applied in the field of computers, which can solve the problems of not being able to solve the heat dissipation of batch computers, reducing the service life of computers, affecting the operation of computers, etc., and achieving the effects of strong structure, improved service life and convenient operation.
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[0030] The embodiment of the present application provides a heat dissipation device, which can simultaneously absorb heat in multiple computers, so that the computer can dissipate heat and increase the service life of the computer.
[0031] In order to enable those skilled in the art to better understand the solutions of the application, the technical solutions in the embodiments of the application will be described below in conjunction with the drawings in the embodiments of the application. Obviously, the described embodiments are only a part of the application. Examples, not all examples. Based on the embodiments in this application, they should all fall within the protection scope of this application.
[0032] Such as figure 1 As shown, figure 1 It is a schematic diagram of an embodiment of a heat dissipation device in an embodiment of the present invention. Can include:
[0033] The first box body 1, the horizontal plate 2, the switch 3, the suction fan 4, the exhaust pipe 5, ...
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