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A thermal print head with heat dissipation function

A thermal printing head and functional technology, applied in printing and other directions, can solve the problems of waste heat accumulation, untimely heat dissipation of heat sink, poor printing effect, etc., and achieve the effect of high degree of automation

Active Publication Date: 2020-05-12
HEFEI FILIM DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During high-energy printing, due to the large amount of heat generated by the heating resistor on the ceramic substrate, the cooling plate does not dissipate heat in time, resulting in the accumulation of residual heat during printing, resulting in poor printing results

Method used

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  • A thermal print head with heat dissipation function
  • A thermal print head with heat dissipation function
  • A thermal print head with heat dissipation function

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Effect test

Embodiment Construction

[0018] Such as Figure 1-2 as shown, figure 1 It is an axonometric view of a thermal print head with heat dissipation function proposed by the present invention, figure 2 It is a side view of a thermal print head with heat dissipation function proposed by the present invention.

[0019] refer to Figure 1-2 , a thermal print head with heat dissipation function proposed by the present invention, comprising a ceramic substrate 1, a printed circuit board 2, a heat dissipation plate 3, an encapsulation glue 4, a plurality of bimetallic sheets 5 and a plurality of medium pipes 6;

[0020] The ceramic substrate 1 has a cubic structure, the ceramic substrate 1 and the printed circuit board 2 are fixed on the same side of the heat sink 3, and the ceramic substrate 1 and the printed circuit board 2 are connected by an encapsulation glue 4;

[0021] A plurality of bimetallic strips 5 are fixed on the side of the heat dissipation plate 3 away from the ceramic substrate 1 and the prin...

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PUM

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Abstract

The invention discloses a thermosensitive printing head with a heat dissipating function. A ceramic substrate and a printed circuit board are fixed to the same side of a heat dissipating plate and connected through encapsulation adhesive. A plurality of bimetallic strips are fixed to the side, away from the ceramic substrate and the printed circuit board, of the heat dissipating plate and arrangedin parallel. The connecting line between the multiple bimetallic strips is perpendicular to the planes where the bimetallic strips are located. A plurality of medium pipelines are located between themultiple bimetallic strips, and the bimetallic strips in a bent state abut against the medium pipelines. According to the thermosensitive printing head with the heat dissipating function, heat on theceramic substrate is conducted along the heat dissipating plate and the bimetallic strips in sequence, as heat on the bimetallic strips is gradually increased, the bimetallic strips are bent towardsthe passive layer sides and finally abut against the medium pipelines, the heat on the bimetallic strips are taken away by a heat dissipating medium in the medium pipelines, accordingly, the purpose of heat dissipating is achieved, and when the temperature of the thermosensitive printing head is gradually decreased, the bimetallic strips gradually restore the original shapes.

Description

technical field [0001] The invention relates to the technical field of thermal printers, in particular to a thermal print head with heat dissipation function. Background technique [0002] At present, thermal print heads generally include ceramic substrates, printed circuit boards, heat sinks, encapsulants, integrated circuits, and gold wires. [0003] Traditional thermal print heads form multiple heating resistors on a ceramic substrate made of insulating materials, and signal lines are laid on the printed circuit board. Usually, the ceramic substrate and the printed circuit board are bonded to the heat sink, and the integrated circuit is bonded. On the ceramic substrate or printed circuit board, the connection of the circuit is realized through gold wire, etc., and the integrated circuit and gold wire are packaged and protected with packaging glue. [0004] During high-energy printing, due to the large amount of heat generated by the heating resistor on the ceramic substr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/335
CPCB41J2/335B41J2/3358
Inventor 蒋军潘发春
Owner HEFEI FILIM DIGITAL TECH CO LTD