Chip glue dripping device

Abstract

The invention discloses a chip glue dripping device. A rotating disc is provided with through wholes which are arranged around the rotation center of the rotating disc annularly at interval, a chip casing enters the corresponding through hole via a conveying guide rail, the rotating disc rotates intermittently, when the through hole loaded with the chip casing is rotated to position under a glue dripping syringe, a glue dripping driving unit drives a movable rack to move downwardly, the glue dripping syringe drips glue into the chip casing, while the glue dripping syringe moves downwardly anddrips glue, the lower end of a push rod extends into the through hole loaded with the chip casing dripped with the glue, the push rod jacks het chip casing dripped with the glue out of the through hole, the glue dripping driving unit drives the movable rack to move upwardly, the lower end of the push rod and the lower end of the glue dripping syringe withdraw from the corresponding through hole, the rotation driving unit drives the rotating disc to rotate again, feeding of the conveying guide rail, glue dripping of the glue dripping syringe and discharging of the push rod are implemented synchronously, and circulated running of the device is realized. The chip glue dripping device is used for processing and production of the chip.

Description

technical field [0001] The invention relates to the field of chip manufacturing, in particular to a chip dispensing device. Background technique [0002] When the car key is turned on, the engine control unit (ECU) on the car will send a set of encrypted electronic coding signals to the chip in the car key. Only when the car ECU unit can read the feedback and receive the correct anti-theft code signal to allow the vehicle to start. Therefore, even a simple car key without any buttons can also be used to activate and open the anti-theft system of the vehicle through the internal chip code. The chip is generally composed of a shell and an integrated block. The integrated block is installed in the shell. In order to fix the integrated block, glue needs to be added to the shell to fix the integrated block. The existing chip production process is to manually add glue to the shell. Usually, the shells are arranged on the corresponding plate frame, and then the glue needle is ins...

AI Technical Summary

Problems solved by technology

The existing chip production process is to manually add glue to the shell. Usually, the shell is arranged on the corresponding plate frame, and then the glue needle is inserted into the shell to carry out the glue. Such a glue dropping process is very cumbersome. 1. The production efficiency is very low, which cannot meet the production needs of large quantities, and the amount of manual dripping is uneven. Some shells have insufficient glue, which leads to the fact that the glue does not play the role of fixing the integrated block. Some shells have excessive glue and overflow. Come to the surface of the shell, affecting the sensitivity of the chip

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