A Millimeter-Scale Ultramicrocomputer for Trusted Signatures
A millimeter-scale, ultra-miniature technology, applied in computing, program control design, data processing applications, etc., can solve problems such as inability to bind with physical objects, and inability to use physical files to prevent counterfeiting.
Active Publication Date: 2021-02-26
国际商业机器(中国)投资有限公司
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] Existing signatures are mainly divided into physical signatures (such as seals, signatures, etc.) and electronic signatures (such as electronic signatures in electronic documents), while physical signatures are easy to forge, and electronic signatures only protect electronic documents. Cannot be bound with physical objects, that is, cannot be used for anti-counterfeiting of physical documents
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] The development of the semiconductor industry has enabled the integration of hundreds of thousands of transistors in a millimeter-sized area, achieving a computing level comparable to that of X86 computers in the 1990s. In this context, the present invention proposes a millimeter-scale ultra-microcomputer for trusted signatures. Encryption and electronic signature software are deployed in the millimeter-scale ultra-microcomputer, which can combine physic...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a millimeter-level ultramicrocomputer for credible signature. The ultramicrocomputer comprises a processor with main frequency less than 50MHz, a non-volatile memory, a power supply and communication module composed of a photovoltaic unit, a photodetector and an LED unit, and an analog circuit module. The photoelectric detector converts the received optical signal emitted by the external laser into an electrical signal, which is parsed by the analog circuit module and transmitted to the processor. After the processor executes the program stored in the nonvolatile memoryto realize the asymmetric encryption and hashing algorithm, it transmits the calculation result to the analog circuit module, conducts the generated continuous electric signal to the LED unit throughthe modulation processing, and emits the light signal after the modulation, so as to realize the external output of the calculation result. The microcomputer provided by the invention is small in volume and strong in computational ability, and can combine the entity signature with the electronic signature by using the microcomputer provided by the invention, so that the signature can not be tampered with and destroyed.
Description
technical field [0001] The invention relates to the technical field of microcomputers, in particular to a millimeter-level supermicrocomputer used for trusted signatures. Background technique [0002] With the development of semiconductor manufacturing process, computers have become smaller and smaller. Now using the current advanced 22-nanometer or 14-nanometer process, hundreds of thousands of transistors can be integrated on a 100-micron square silicon chip, and at the same time energy consumption can be controlled within the order of microwatts per megahertz, which makes it possible for only millimeters The emergence of ultra-miniature smart devices that are as small as X86 computers in the 1990s is possible. [0003] Existing signatures are mainly divided into physical signatures (such as seals, signatures, etc.) and electronic signatures (such as electronic signatures in electronic documents), while physical signatures are easy to forge, and electronic signatures only...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F9/38G06Q10/10
CPCG06F1/183G06F9/3836G06Q10/10
Inventor 殷玉珏
Owner 国际商业机器(中国)投资有限公司