Substrate processing device and adjustment method thereof

Abstract

The invention provides a substrate processing device and an adjustment method thereof. The device includes a substrate placing table, a lifting pin and an auxiliary component unit; the substrate placing table is used for placing a substrate processed by the device; the lifting pin is vertically inserted in the substrate placing table and arranged to be freely lifted so as to protrude and submergein the surface of the substrate placing table; and the auxiliary component unit is arranged on the substrate placing table and used for clamping and tenoning the connection of a susceptor with the shadow frame of the substrate placing table.

Description

technical field [0001] The present application relates to the field of display, in particular to a substrate processing device and a method for adjusting the substrate processing device. Background technique [0002] In the manufacturing process of a liquid crystal display device, various treatments such as dry etching, sputtering, or chemical vapor deposition are performed on a glass substrate or a semiconductor chip as a substrate to be processed. For example, such processing is performed while the substrate is placed on a substrate stage provided in the chamber, and the substrate is loaded and unloaded on the substrate stage by raising and lowering a plurality of lift pins included in the substrate stage. That is, when the substrate is loaded, the lift pins are made to protrude from the surface of the stage main body, the substrate placed on the transfer arm is moved onto the pins, and the lift pins are lowered. In addition, when unloading the substrate, the lift pins ar...

AI Technical Summary

Problems solved by technology

[0003] Since the lift pins of this kind of substrate mounting table are raised and lowered in the mounting table body, if the transfer arm contacts the lifting pins and the like in the state where the lift pins protrude from the mounting table body, the substrate mounting table may be damaged. set itself

[0004] However, the height of the susceptor on the substrate mounting table and the rest button that fits the shadow frame is not high enough, which causes the position of the shadow frame to shift when it is actuated, causing the film to deflect and cause arcing ) and substrate glass in the machine, and caused the chamber (chamber) to rise and fall in temperature, lost up to 5 days of normal operation time, affected output, and increased susceptor (susceptor) and frame (shadow frame) repair times and costs

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