Motor controller

Abstract

The invention discloses a motor controller. The advantages of the motor controller are that the controller has bare mounting ability of electronic device fine elements and strong heat dissipation capabilities, so that the packaging of electronic components can be saved through the bare mounting of the fine elements, and the purchasing costs of the electronic components can be reduced; and the controller can have better heat dissipation capabilities, and the grades of controlling power can be enhanced. The motor controller includes a controller shell, lead wires, a circuit board, electronic components and plug-in terminals; the electronic components and the plug-in terminals are mounted on the circuit board; the circuit board and the electronic components are embedded in the controller shell; and the circuit board consists of an electronic component patch layer and a ceramic substrate layer.

Description

technical field [0001] The invention relates to a motor controller, in particular to a drive motor controller applied to electric vehicles and new energy vehicles. Background technique [0002] With the development of drive technology in the electric bicycle industry, the development trend of "small volume, high power" technology has become increasingly clear. On the one hand, the purpose is to reduce the volume of electronic devices through the improvement of The improvement of the process improves the overall heat dissipation capacity of the circuit substrate, so that the product can have a better heat dissipation effect while having the same large volume, and the power of the product can also be increased accordingly. [0003] At present, because electronic components must be mounted in a package, the package occupies a large space and affects heat dissipation at the same time. Then, if the electronic components are not packaged, since the heat-sensitive performance of t...

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Problems solved by technology

[0003] At present, because electronic components must be mounted in a package, the package occupies a large space and also affects heat dissipation.

Then, if the electronic components are not packaged, since the heat-sensitive performance of the element is relatively sensitive, and the heat-sensitive response of the circuit substrate is relatively slow, after the element is directly mounted on the circuit substrate, it is easy to cause the element to swell and the circuit to fail.

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