Aging device and aging method for laser device chip

Abstract

The invention relates to the field of optical communication device manufacturing, and provides an aging device and an aging method for a laser device chip. The device comprises a clamp and a chip assembly, wherein the clamp is used for clamping the chip assembly, the chip assembly comprises the laser device chip and a chip carrier, and the laser device chip is fixed to the surface of the chip carrier; the clamp comprises a substrate and a PCB connecting plate, a positioning plate and a pressing block which are installed on the substrate in sequence, the positioning plate is used for placing and positioning the chip assembly, and the PCB connecting plate is used for the connection of the laser device chip and a power supply circuit; the pressing block is movably installed on the surface ofthe substrate, one end of the pressing block is positioned above the positioning plate, and the chip assembly can be compressed or loosened by rotating the pressing block. The laser device chip is fixedly pasted onto the chip carrier, the chip carrier can be clamped by the clamp directly conveniently, quickly, stably, reliably and accurately during aging, chip clamping is realized, the chip damageis reduced, and the clamp is simple in operation and low in cost and can be used repeatedly, so that the problem of chip aging is solved.

Description

【Technical field】 [0001] The invention relates to the field of manufacturing optical communication devices, in particular to an aging device and aging method for a laser chip. 【Background technique】 [0002] In the field of optical communication design and manufacturing, for active optical devices such as Transmitter Optical Subassembly (TOSA), in the manufacturing process, the aging process of the laser chip is an essential step. , which is of great significance to ensure the performance of the device, the stability of communication data and signal transmission, and the reliability of the device. [0003] According to industry rules, when chip manufacturers sell chips to device manufacturers, they usually do not implement the aging process on the chips, which requires device manufacturers to implement the aging process on the laser chips they purchase. However, the size of the laser chip is usually very small, the length, width and height are less than 1 mm, generally only...

AI Technical Summary

Problems solved by technology

However, the size of the laser chip is usually very small, the length, width and height are less than 1 mm, generally only a few tenths of a mm, it is not easy to be directly clamped, and it is easy to be damaged and dirty, and it is also difficult to power the laser chip during the aging process.

Therefore, in the process of manufacturing TOSA, the aging process of the laser chip is very difficult, time-consuming and has low reliability, which is not conducive to the mass production of TOSA. This is a difficult problem in the entire optical communication device manufacturing industry.

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