Multifunctional transfer device for to-be-pressed part of assembly and application method of device

Abstract

The invention relates to a multifunctional transfer device for a to-be-pressed part of an assembly. The device comprises an upper beam, multiple supporting column sets are arranged below the upper beam, and each supporting column set comprises a rear supporting column and a front supporting column; the rear supporting columns and the front supporting columns are arranged at intervals, and the upper ends of the rear supporting columns and the front supporting columns are fixedly connected with the upper beam; supporting pipes are fixedly connected to the rear supporting columns, the end, away from the corresponding rear supporting column, of each supporting pipe penetrates through the corresponding front supporting column and fixedly connected with the corresponding front supporting column,a reinforcement pipe is fixedly connected to the end, away from the corresponding front supporting column, of each supporting pipe, and the other end of each reinforcement pipe is fixedly connected to the corresponding front supporting column. The device is simple and easy to operate, the to-be-pressed part can be effectively stored and transferred in time, the higher bearing and protection function is achieved on the larger and heavier assembly, and the defects are effectively overcome that the to-be-pressed part of the assembly is stored and transferred difficultly, and the to-be-pressed part easily slides down in the transfer or standing process. The yield of the assembly is increased, and the production cost of the assembly is lowered.

Description

technical field [0001] The invention relates to the technical field of photovoltaic module transportation, in particular to a transfer device for a multifunctional module to be pressed and a method for using the same. Background technique [0002] With the continuous renewal and development of the photovoltaic industry, new products such as double-glass modules, half-cut panels, and shingled tiles have increasingly become research hotspots for major photovoltaic module manufacturers. Among them, the double-glass module has become an advantageous product for mass production competition by major module factories because of its following advantages: greatly reducing the incidence of PID, higher reliability, guaranteed service life of 30 years, and higher single power increase , light can pass through to achieve complementary fishing and light, easy to clean and maintain, etc., because the back of the double-glass module is replaced by a 2.5mm thick glass on the back of the back...

AI Technical Summary

Problems solved by technology

Among them, the double-glass module has become an advantageous product for mass production competition by major module factories because of its following advantages: greatly reducing the incidence of PID, higher reliability, guaranteed service life of 30 years, and higher single power increase , light can pass through to achieve complementary fishing and light, easy to clean and maintain, etc., because the back of the double-glass module is replaced by a 2.5mm thick glass on the back of the backplane material of the conventional module, so the overall weight has increased, and there is transfer in the mass production process Difficult issues such as turnover and storage difficulties

[0003] The disadvantage of the existing technology is that in the production process of components, it is often necessary to store and transfer the components to be pressed that have not been laminated to the rework area due to abnormalities such as solder joints, foreign objects, cracks, or line blockages before lamination. For rework or temporary transfer, since the components have not yet been laminated, the cell materials are fragile and easy to break, so they cannot be stacked together and placed together. It is necessary to use suitable devices for effective placement to avoid damage to the components. As a result, the yield rate of components decreases, and the cost of component manufacturing increases, but currently there is no device that can adapt to the transfer of all types of component laminates

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