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A kind of copper surface phosphate ester assembly liquid and its application

A technology of surface phosphoric acid and assembly solution, applied in the chemical industry, can solve the problems of easy corrosion of copper surface, and achieve the effects of low cost, reduced dosage and shortened processing time.

Active Publication Date: 2021-03-02
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper surface phosphate ester assembly solution and its application in order to overcome the above-mentioned defects in the prior art, prepare a copper surface phosphate ester corrosion inhibiting assembly film, and solve the problem of copper surface in the prior art. Technical problems that are prone to corrosion in corrosive environments

Method used

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  • A kind of copper surface phosphate ester assembly liquid and its application
  • A kind of copper surface phosphate ester assembly liquid and its application
  • A kind of copper surface phosphate ester assembly liquid and its application

Examples

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Embodiment 1

[0047] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution of different concentrations, the solvent is ethanol, and the concentrations of triethyl phosphate are 0.001, 0.005, 0.008, 0.01 mM, 0.02 mM respectively.

[0048] The preparation method of phosphate ester assembly film on copper surface is:

[0049] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 1h assembly, the assembly temperature is room temperature, and the surface-to-volume ratio is 20mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

[0050] Soak the phosphate ester assembly film on the copper surface in 3wt.% NaCl...

Embodiment 2

[0055] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution with different concentrations, the solvent is ethanol, and the concentration of triethyl phosphate is 0.01 mM respectively.

[0056] The preparation method of phosphate ester assembly film on copper surface is:

[0057] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 1h, the assembly temperature is 35°C, and the surface-to-volume ratio is 50mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

Embodiment 3

[0059] The copper surface phosphate ester assembly solution in this embodiment is triethyl phosphate assembly solution with different concentrations, the solvent is ethanol, and the concentration of triethyl phosphate is 0.01 mM respectively.

[0060] The preparation method of phosphate ester assembly film on copper surface is:

[0061] (1) Grind the 0.5cm×1.0cm copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper, and then polish it with 5μm, 3.5μm, 2.5μm and 1.5μm polishing paste, and use ethanol Decontamination and degreasing treatment, then wash with deionized water, and set aside; (2) Immerse the rinsed copper sheet in triethyl phosphate assembly solution for 5 hours, the assembly temperature is 5°C, and the surface-to-volume ratio is 40mL / cm 2 , to obtain a phosphate-based assembled film on the copper surface.

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Abstract

The present invention relates to a copper surface phosphate ester assembly solution and its application, comprising triethyl phosphate and a solvent, the concentration of the triethyl phosphate is 0.001-0.02mM, preferably 0.01mM, and the solvent is ethanol; application method In order to grind and polish the copper sheet step by step with 400, 800, 1600 and 2000 mesh metallographic sandpaper and 5 μm, 3.5 μm, 2.5 μm and 1.5 μm grinding paste, and then clean it with absolute ethanol and deionized water in turn; the obtained The copper sheet was immersed in the phosphate ester assembly solution on the copper surface and assembled for 1 hour to obtain the phosphate ester assembly film on the copper surface. Compared with the prior art, the present invention has the advantages of short processing time, simple method, easy operation, less usage, low cost, strong stability of the assembled film and does not affect the properties of the metal material itself.

Description

technical field [0001] The invention belongs to the field of chemical industry and relates to the anticorrosion technology of metal materials, in particular to a copper surface phosphate ester assembly liquid and its application. Background technique [0002] Copper and its alloys have good electrical conductivity, thermal conductivity, machining and corrosion resistance, and are widely used in many fields such as electronic products, light industry, mechanical equipment manufacturing and marine industry. However, in some corrosive media, such as Cl - In the solution of ions, the long-term operation of these parts will cause serious corrosion and damage, which will greatly reduce the service life, eventually lead to huge economic losses, and bring many adverse effects to production and use. The anti-corrosion method of corrosion inhibitor is simple and the investment in equipment is small. It is a low-cost and effective method. The use of self-assembly technology to prepar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F11/167
CPCC23F11/1673
Inventor 张大全施成高立新葛正韬
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER
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