Thin film transistor and manufacturing method thereof, array substrate and display device

A technology of thin film transistors and manufacturing methods, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., and can solve problems such as adverse effects of thin-film transistor characteristics, reduction of on-state current of thin-film transistors, and reduction of stability of thin-film transistors

Active Publication Date: 2019-02-26
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thin film transistors generally include a gate, an active layer, a source and a drain, etc. In some thin film transistors, the source and drain adopt a double-layer metal structure, however, the upper metal diffuses to the channel position in the active layer, As a result, the characteristics of the thin film transistor are adversely affected, and the stability of the thin film transistor is reduced; for example, the on-state current of the thin film transistor is reduced, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin film transistor and manufacturing method thereof, array substrate and display device
  • Thin film transistor and manufacturing method thereof, array substrate and display device
  • Thin film transistor and manufacturing method thereof, array substrate and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041]Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present invention shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the embodiments of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar wo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Embodiments of the invention provide a thin film transistor, a manufacturing method thereof, an array substrate, and a display device, and relates to the field of electronic devices. The thin film transistor is capable of reducing probability that metal atoms in a second metal layer in a source electrode and/or a drain electrode diffuse to a channel region. The thin film transistor comprises: an active layer disposed on the substrate; and a source electrode and a drain electrode in contact with the active layer; wherein the source electrode and the drain electrode comprise a first metal layerand a second metal layer arranged in a stacked manner, and the first metal layer is adjacent to the active layer relative to the second metal layer. Area of an overlapping area of orthographic projection of the second metal layer in the source electrode and the active layer on the substrate is smaller than area of an overlapping area of orthographic projection of the first metal layer and the active layer in the source electrode on the substrate; and/or area of an overlapping area of orthographic projection of the second metal layer and the active layer in the drain electrode on the substrateis smaller than area of an overlapping area of orthographic projection of the first metal layer in the drain electrode and the active layer on the substrate.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a thin film transistor, a manufacturing method thereof, an array substrate, and a display device. Background technique [0002] A thin film transistor (Thin Film Transistor, TFT), as a commonly used electronic device, has a wide range of applications in the electronic field. Thin film transistors generally include a gate, an active layer, a source and a drain, etc. In some thin film transistors, the source and drain adopt a double-layer metal structure, however, the upper metal diffuses to the channel position in the active layer, Therefore, the characteristics of the thin film transistor are adversely affected, and the stability of the thin film transistor is reduced; for example, the on-state current of the thin film transistor is reduced. Contents of the invention [0003] Embodiments of the present invention provide a thin film transistor and its manufacturing method, an ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/786H01L21/336H01L29/417H01L27/12
CPCH01L27/1214H01L29/41733H01L29/66742H01L29/78618H01L27/1233H01L27/1237H01L27/1251H01L27/127
Inventor 操彬彬
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products