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Low-stress white epoxy molding compound for high-power LED reflector cups

A technology of epoxy molding compound and reflective cup, which is applied in the field of white epoxy molding compound, can solve problems such as desoldering of welding wire and metal wiring, increase of moisture absorption corrosion failure, research on material toughening, etc., to reduce stress and increase strength , good fluidity effect

Inactive Publication Date: 2019-03-08
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the epoxy molding compound is cured, the crosslinking density is high and the internal stress is large, which will cause a series of problems such as fracture defects inside the molding compound, welding wire breakage, desoldering between the welding wire and the metal wiring, and serious dislocation with the frame disengaged, increasing the likelihood of failure due to moisture absorption corrosion
[0004] Japanese patent CN102408544B discloses a thermosetting resin for light reflection that has high reflectivity in the visible light to ultraviolet light reg

Method used

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  • Low-stress white epoxy molding compound for high-power LED reflector cups
  • Low-stress white epoxy molding compound for high-power LED reflector cups

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Embodiment Construction

[0024] (1) Preparation of epoxy resin prepolymer: Mix epoxy resin and antioxidant uniformly in molten state according to the proportion, then add acid anhydride curing agent, coupling agent and polyol to melt and mix under appropriate conditions, and then put it into Put it into an oven at 40°C-100°C for post-curing for 8 h-30 h to obtain an epoxy resin prepolymer with a softening point of 50°C-100°C.

[0025] (2) Preparation of white epoxy molding compound for LED: First, crush the epoxy resin prepolymer so that the particles are smaller than 3mm, then weigh each component according to the proportion, mix them evenly in a high-speed mixer, and then mix them at a certain speed Add it into a twin-screw kneader, melt and mix it at 60°C-110°C, extrude, calender and cool to obtain a solid flake material, crush and sieve to obtain a granular powder material smaller than 2mm, and pass the granular powder material through the cake making process The cake is beaten to obtain a cake-sh...

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Abstract

The invention mainly relates to low-stress white epoxy molding compound for high-power LED reflector cups, which comprises an epoxy resin prepolymer, a modified silane coupling agent, a filling material, a colorant, a curing accelerant, and a mold release agent. The white epoxy molding compound with the modified silane coupling agent has good toughness and small warpage, has good mobility and highTg, is well bindable to base wire frame, is high in reflectivity and is applicable to high-power LED reflector cup materials.

Description

technical field [0001] The invention relates to a white epoxy molding compound, in particular to reflective cup materials used in lighting, displays, mobile phone backlights, lighting auxiliary light sources and other commercial light sources, in particular to a low-stress white epoxy for high-power LED reflective cups molding compound. Background technique [0002] In recent years, with the continuous advancement of technology, the efficiency and brightness of light-emitting diodes have been continuously improved, and their application scope has gradually extended to display backlight modules and automotive light sources. High-power and high-brightness LEDs will become the mainstream of future development. [0003] Compared with traditional PPA and other materials, white epoxy molding compound has significant advantages in terms of light reflectivity, thermal expansion coefficient, and material connection strength after high-temperature aging, and has gradually become an i...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/04C08K5/544C08K5/5435C08K3/36C08K7/28
CPCC08K3/36C08K5/5435C08K5/544C08K7/28C08K13/04C08K2201/011C08L2201/08C08L63/00
Inventor 陈子栋翁根元费小马刘娜尹红根
Owner WUXI CHUANGDA ELECTRONICS