Laminated inductor and manufacturing method thereof

A technology of laminated inductors and manufacturing methods, applied in the direction of inductor/transformer/magnet manufacturing, coating, circuit, etc., can solve problems such as environmental pollution, dissatisfaction, time-consuming and material costs, etc., and achieve simple process maintenance and improved Efficiency, remarkable effect

Inactive Publication Date: 2019-03-08
JINKAI GUANGZHOU ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. By increasing the thixotropic index and viscosity of the slurry and adjusting the coating parameters, it takes a lot of time and material costs, not only the effect is not significant but also the consistency and reproducibility are poor;
[0007] 2. Hydrophobic modification treatment is carried out on the surface of multi-terminal chip components through hydrophobic liquid, so that the hydrophobic film layer formed on the surface

Method used

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  • Laminated inductor and manufacturing method thereof
  • Laminated inductor and manufacturing method thereof
  • Laminated inductor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0048] A method for plasma treatment of the surface of a multi-terminal component, comprising the following steps:

[0049] Step 1: Prefabricated target

[0050] The target is made of iron material into a rectangular box shape, the width and height of the box are 40cm, and the length of the box is made or segmented according to needs;

[0051] Step 2: Assembly

[0052] Place the multi-terminal chip components on the upper surface of the conveyor belt and pass through the middle of the target without contacting the target. The conveyor belt shaft is located at both ends of the target, and the target is placed in a vacuum chamber. The target, multi-terminal chip components and The conveyor belts are all insulated from the vacuum chamber;

[0053] Step 3: Load the monomer, ventilate, and power on

[0054] Load monomer HMDSO (hexamethyldisiloxane), feed argon as the carrier, set the target to negative potential, voltage -2600V; adjust the transmission shaft to keep the conveyor...

example 2

[0058] A method for plasma treatment of the surface of a multi-terminal component, comprising the following steps:

[0059] Step 1: Prefabricated target

[0060] The target is made of copper material into a rectangular box shape, the width and height of the box are 10cm, and the length of the box is made or segmented according to needs;

[0061] Step 2: Assembly

[0062] Place the multi-terminal chip components on the upper surface of the conveyor belt and pass through the middle of the target without contacting the target. The conveyor belt shaft is located at both ends of the target, and the target is placed in a vacuum chamber. The target, multi-terminal chip components and The conveyor belts are all insulated from the vacuum chamber;

[0063] Step 3: Load the monomer, ventilate, and power on

[0064] Load monomer HMDSO (hexamethyldisiloxane), feed argon as the carrier, set the target to negative potential, voltage -1000V; adjust the transmission shaft to keep the convey...

example 3

[0068] A method for plasma treatment of the surface of a multi-terminal component, comprising the following steps:

[0069] Step 1: Prefabricated target

[0070] The target is made of iron material into a rectangular box shape, the width and height of the box are 25cm, and the length of the box is made according to the needs

[0071] or segment;

[0072] Step 2: Assembly

[0073] Place the multi-terminal chip components on the upper surface of the conveyor belt and pass through the middle of the target without contacting the target. The conveyor belt shaft is located at both ends of the target, and the target is placed in a vacuum chamber. The target, multi-terminal chip components and The conveyor belts are all insulated from the vacuum chamber;

[0074] Step 3: Load the monomer, ventilate, and power on

[0075] Load monomer HMDSO (hexamethyldisiloxane), feed argon as the carrier, set the target to negative potential, voltage -1800V; adjust the transmission shaft to keep ...

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PUM

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Abstract

The invention discloses a laminated inductor and a manufacturing method thereof. The laminated inductor comprises the following steps: S1, the surface of an electronic component is subjected to plasmamodification treatment before an external electrode coats the electronic component, and a uniform SiOx film layer is generated by deposition on the surface of the electronic component, so that a certain hydrophobic performance is obtained by the surface of the electronic component, wherein the electronic component is especially a multi-terminal chip component; and S2, the electronic component iscoated with electrode slurry to form the external electrode. The invention further discloses a laminated inductor and a manufacturing method thereof. According to the method, the external electrode coating the component can be straight, smooth and free of fish maw and glitches.

Description

technical field [0001] The present invention relates to a laminated inductor and its manufacturing method. Background technique [0002] In recent years, with the application and continuous improvement of microelectronic circuit surface mount technology (SMT), lightness, thinness, shortness, and smallness have become important symbols for measuring electronic products. To miniaturize electronic equipment, we must first consider the electronic Miniaturization of components. After the miniaturization of electronic components, the precision and appearance requirements of the external electrodes of the products have also raised new heights. After the size of components is miniaturized, the size and spacing of terminal electrodes are getting smaller and smaller, especially for multi-terminal chip components such as filters, magnetic bead rows, and pressure-sensitive rows. Multiple electrodes are required on one terminal, such as external electrodes The accuracy and straightness...

Claims

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Application Information

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IPC IPC(8): H01F41/00C23C16/40C23C16/513
CPCH01F41/00C23C16/401C23C16/513
Inventor 梁水金
Owner JINKAI GUANGZHOU ELECTRONICS CO LTD
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