The invention provides an 
adhesive film. The 
adhesive film has the characteristic of simple assembling, the 
adhesive film also has the characteristics of high relative 
dielectric constant, good light proofness, adjustable color, strong adhesive strength, and the like, and the relative 
dielectric constant in over 6, therefore, the adhesive film is especially applicable to the adhering of capacitive 
fingerprint recognition 
chip module encapsulation. The adhesive film is a semi-cured adhesive film which has low 
viscosity at 
room temperature, but has high 
viscosity in the process of 
thermal curing; compared with a common dispensed adhering mode, the adhesive film provided by the invention has the advantages of uniform film-forming thickness, controllable adhering shape, no bubble produced, simple assembling process, and the like, therefore, the adhesive film is especially suitable for plane adhesive 
assembly. The invention provides an adhesive composition for forming the adhesive film. The adhesive composition has the characteristics of high relative 
dielectric constant, and the like. The invention also provides an adhesive film roll. The adhesive film is protected by covering PET 
release liner or release paper on both sides of the adhesive film in the adhesive film roll, thereby preventing the environment from polluting the adhesive film.