LED device and manufacturing method thereof

Abstract

The invention provides an LED device and a manufacturing method thereof. The LED device comprises a substrate unit, a light emitting unit, a light transmitting unit and a light shielding unit; the light emitting unit is fixed on the substrate unit, and the light transmitting unit is covered on the periphery of the light emitting unit; and a light transmitting portion for allowing the light of thelight emitting unit to pass through is arranged at the outside of the surface of the light transmitting unit in advance, and the light shielding unit covers the rest positions excluding the light transmitting portion on the surface of the light transmitting unit. The light emitting direction of the LED device can be controlled as needed through a light transmitting hole on the light shielding unit, so that the practicability is good. The manufacturing method of the LED device comprises: forming the light transmitting units and the light shielding units of a plurality of LED devices in one injection molding process by using a light transmitting layer mould and a light shielding layer mould, so that the processing efficiency is higher; and by using a cutter cutting mode and by reasonably setting the cutting track, the cutting object and the cutting depth of a cutter, a light transmitting layer, a light shielding layer and a substrate can be efficiently separated.

Description

technical field [0001] The invention relates to the field of LED devices, in particular to an LED device and a manufacturing method thereof. Background technique [0002] Patent No. CN201310116168.4, the patent titled "Light Emitting Diode Packaging Structure and Its Manufacturing Method" discloses a light emitting diode packaging structure and its manufacturing method. In specific implementation, the manufacturing method of the light-emitting diode packaging structure described in this patent has the following disadvantages: [0003] In the step of coating the light-emitting element with the light-transmitting colloid, each light-transmitting colloid is set separately and formed by compression molding. In actual processing, it is necessary to use a multi-cavity mold for compression molding. Multi-cavity The cost of the body mold and the purchase cost of the corresponding press are relatively high, and the molding is difficult; [0004] In the step of removing the light-sh...

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Problems solved by technology

[0004] In the step of removing the light-shielding material to expose the top of the light-transmitting colloid to form the light-transmitting part, this patent is realized by grinding and other methods. Due to the existence of processing errors, it is difficult to remove the light-shielding material completely and accurately in each process It does not affect the light-transmitting colloid. Therefore, every time the process of removing the light-shielding material is always accompanied by cutting of the light-transmitting colloid, the surface molding quality is poor, and the specific performance is that the optical path is on the surface of the light-transmitting colloid. The uncontrollability is enhanced, which is not conducive to the formation of a light source with a stable luminous angle;

[0005] In addition, for the light-emitting diode structure in this patent, limited by the manufacturing method, since the top surface of the light-transmitting colloid and the top surface of the black glue are always flat, resulting in a large light-emitting angle

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