Optical fingerprint sensor, terminal device and processing technology of optical fingerprint sensor
A technology of fingerprint sensor and terminal equipment, which is applied in the direction of acquiring/organizing fingerprints/palmprints, instruments, characters and pattern recognition, etc. It can solve the problem of uneven bonding surface of glue, generation of air bubbles, and affecting the realization of the effect of optical fingerprint sensors And other issues
Pending Publication Date: 2019-03-12
LENS TECH CHANGSHA
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Problems solved by technology
[0002] In the existing optical fingerprint sensor, since the COF flexible circuit board is arranged on one side of the glass substrate, and the photosensitive pixel layer and other hierarchical structures are arranged on the same side of the glass substrate, and the COF flexible circuit board and the optical There is a height difference of 50um between the sensing pixel layer and other hierarchical structures, so when the side of the glass substrate on which the COF flexible circuit board is placed and the glass cover of the terminal device are bonded together with glue, the bonding surface of the glue is uneven and Bubbles will be generated, which will affect the realization of the effect of the optical fingerprint sensor
At the same time, in the prior art, the COF flexible circuit board will be bent with a large arc. In actual processing, the bending process is difficult to realize, and the production capacity of the automatic machine is low.
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0033] It should be noted that like numerals and let...
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The embodiment of that present invention relate to the technical field of optical fingerprint sensors, in particular to an optical fingerprint sensor, A technology for manufacture a terminal device and an optical fingerprint sensor the second circuit board of the optical fingerprint sensor is arranged opposite to the glass substrate, the photosensitive pixel layer is arranged on the side of the glass substrate facing the second circuit board, One end of the first circuit board is arranged on a side of the glass substrate facing the second circuit board through an anisotropic conductive adhesive, and the other end of the first circuit board is bent with respect to an end of the glass substrate and is connected with the side of the second circuit board facing the glass substrate through theanisotropic conductive adhesive. A glue is uniformly paved between the other side of the glass substrate opposite to the side where the light-sensing pixel layer is arranged and the glass cover plateof the terminal device. The glue between the glass substrate and the glass cover plate of the terminal equipment is leveled without bubbles.
Description
technical field [0001] The invention relates to the technical field of optical fingerprint sensors, in particular to an optical fingerprint sensor, a terminal device and an optical fingerprint sensor processing technology. Background technique [0002] In the existing optical fingerprint sensor, since the COF flexible circuit board is arranged on one side of the glass substrate, and the photosensitive pixel layer and other hierarchical structures are arranged on the same side of the glass substrate, and the COF flexible circuit board and the optical There is a height difference of 50um between the sensing pixel layer and other hierarchical structures, so when the side of the glass substrate on which the COF flexible circuit board is placed and the glass cover of the terminal device are bonded together with glue, the bonding surface of the glue is uneven and Bubbles will be generated, which will affect the realization of the effect of the optical fingerprint sensor. At the s...
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IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 周群飞
Owner LENS TECH CHANGSHA