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High-voltage LED chip with multiple crystal strings

A LED chip, high-voltage technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of reducing the luminous efficiency and light pattern of the chip, occupying the luminous area of ​​the chip, increasing the overall volume of the high-voltage LED chip and the package volume, etc., to achieve saving The effect of reducing area, reducing wiring, and reducing volume

Pending Publication Date: 2019-03-12
FOSHAN NATIONSTAR SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bridging position occupies a large amount of light-emitting area of ​​the chip, increases the overall volume

Method used

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  • High-voltage LED chip with multiple crystal strings
  • High-voltage LED chip with multiple crystal strings

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Embodiment Construction

[0022] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings.

[0023] See figure 1 , The present invention provides a polycrystalline string high-voltage LED chip, including M flip-chip LED chips 1 and M+1 regular-mounted LED chips 2, M≧1, and the P electrode 21 of the first front-mounted LED chip 2 is the package anode In the wire bonding area, the N electrode 22 of the M+1th front-mounted LED chip 2 is the negative wire bonding area of ​​the package, where the P electrode 11 of the flip-chip LED chip 1 is connected to the N electrode 22 of the front-mounted LED chip 2, and the flip-chip LED The N electrode 12 of the chip 1 is connected to the P electrode 21 of the front-mounted LED chip 2, and M flip-chip LED chips 1 connect M+1 front-mounted LED chips 2 in series.

[0024] The present invention connects the flip-chip LED chi...

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Abstract

The invention discloses a high-voltage LED chip with multiple crystal strings, comprising M flip LED chips and M+1 positively mounted LED chips, M is greater than or equal to 1, a P electrode of the first positively mounted LED chip is a package positive electrode wire bonding area, an N electrode of the (M+1)th positively mounted LED chip is a package negative electrode wire bonding area, wherein the P electrodes of the flip LED chips are connected to the N electrodes of the positively mounted LED chips, the N electrodes of the flip LED chips are connected to the P electrodes of the positively mounted LED chips, and the M+1 positively mounted LED chips are connected in series via the M flip LED chips. According to the high-voltage LED chip with multiple crystal strings disclosed by the invention, the flip LED chips are connected above the positively mounted LED chips, the positively mounted LED chips are connected in series via the flip LED chips, the traditional bridging mode is replaced, and the wire bonding is reduced, thereby saving the area necessary for the wire bonding and reducing the volume of the high-voltage LED chip.

Description

Technical field [0001] The present invention relates to the technical field of light emitting diodes, in particular to a polycrystalline string high-voltage LED chip. Background technique [0002] With the continuous improvement of LED (light emitting diode) luminous efficiency, LED has become one of the most valued light sources in recent years. With the development of LED technology, LEDs directly driven by high voltage have been realized. The efficiency of high-voltage LEDs is better than that of traditional low-voltage LEDs, mainly due to the low-current, multi-unit design that can evenly spread the current, and the high-voltage LED can achieve direct high-voltage driving, thereby saving the cost of LED driving. [0003] Existing high-voltage LED chips generally adopt a bridging method to connect the positive and negative electrodes of multiple independent LED chips to form a series connection. The bridge position occupies a large amount of light-emitting area of ​​the chip, ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/62
CPCH01L25/075H01L33/62
Inventor 仇美懿庄家铭
Owner FOSHAN NATIONSTAR SEMICON