A kind of flexible display panel, display device and preparation method thereof

A flexible display and panel technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as affecting the life of flexible display panels, reducing water and oxygen barrier capabilities, and film packaging failure, to prevent peeling, The effect of improving bending strength and increasing material density

Active Publication Date: 2020-03-20
YUNGU GUAN TECH CO LTD
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Problems solved by technology

[0003] In the long-term research and development process, the inventors of the present application have found that the adhesion between the organic layer and the inorganic layer of the thin film package is small, and during the bending and folding process of the flexible display panel, the adhesion between the organic layer and the inorganic layer is reduced, and it is easy to peel off each other , reduce the water and oxygen barrier ability, and even lead to the failure of thin film packaging, so that water and oxygen can invade the internal device structure, affecting the life of the flexible display panel

Method used

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  • A kind of flexible display panel, display device and preparation method thereof
  • A kind of flexible display panel, display device and preparation method thereof
  • A kind of flexible display panel, display device and preparation method thereof

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Embodiment Construction

[0027] In order to make the purpose, technical solution and effect of the present application more clear and definite, the present application will be further described in detail below with reference to the accompanying drawings and examples.

[0028] The present application provides a flexible display panel, which includes a thin film encapsulation layer, and the thin film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer. Among them, a plurality of grooves are provided on the side of the organic packaging layer away from the light-emitting layer, and the inorganic packaging layer material fills the grooves, so that the inorganic packaging material is embedded in the organic packaging material, which can strengthen the gap between the organic packaging layer and the inorganic packaging layer. Especially in the bending process of the display panel, it can prevent the peeling between layers, thereby improving the packaging performan...

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Abstract

The present application discloses a flexible display panel, a display device and a manufacturing method thereof. The flexible display panel includes a light-emitting layer and a first organic encapsulation layer and a second inorganic encapsulation layer arranged sequentially on one side of the light-emitting layer; wherein, the first organic The side of the encapsulation layer away from the light-emitting layer is provided with a plurality of grooves, the second inorganic encapsulation layer covers the first organic encapsulation layer and fills the grooves, and the material density of the part corresponding to the grooves of the first organic encapsulation layer is higher than that of the remaining part density. Through the above method, the present application can enhance the adhesion between the thin film encapsulation layer and the layers, and prevent the layers from being peeled off from each other.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a flexible display panel, a display device and a manufacturing method thereof. Background technique [0002] With the development of display technology, flexible display technology has received extensive attention as a new technology in the display field. For example, flexible and foldable organic light-emitting diode (Organic Light-Emitting Diode, OLED) display is one of the current hot development trends. Generally, in order to prevent water and oxygen from contacting and corroding OLED light-emitting materials, it is necessary to use thin film encapsulation (TFE) to encapsulate OLED devices. [0003] In the long-term research and development process, the inventors of the present application have found that the adhesion between the organic layer and the inorganic layer of the thin film package is small, and during the bending and folding process of the flexible displ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/844H10K71/00
Inventor 石邦杰陈闻凯邱林林王会吴伟力
Owner YUNGU GUAN TECH CO LTD
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