Method for detecting circuit board via hole quality based on photoelectric effect
A detection method and circuit board technology, applied in the direction of optical testing flaws/defects, measuring devices, material analysis through optical means, etc., can solve the problems of long inspection time, low inspection efficiency, less drilling, non-drilling, plugged holes, etc. problem, to achieve the effect of short detection time, high detection efficiency and wide application range
Active Publication Date: 2019-03-19
江门市利诺达电路科技有限公司
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Problems solved by technology
[0002] The quality problems of holes caused in the process of circuit board production are relatively common defects, such as under-drilling, under-drilling, and plugged holes. For products, the existing technology is to inspect the holes visually, but in the process of inspecting workpieces in large quantities, this inspection method takes a long time, has low inspection efficiency, and is easy to miss. The method of testing whether the probe can pass through the hole is qualified, but only the printed board with the same specification and the same hole diameter can be tested. Otherwise, the test board must be remade according to the position of different holes. This inspection method is costly and the inspection efficiency is high. Low
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0023] Such as figure 1 and figure 2 As shown, a preferred embodiment of the present invention, a method for detecting the quality of a circuit board via hole based on the photoelectric effect, comprises the following steps:
[0024] S1: Put the standard circuit board 1 into the workbench 2 and fix it with the clamp 12, move the detection rod 5 to the position opposite to each standard hole in the standard circuit board 1 in turn through the moving device 3, and ...
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The invention provides a method for detecting the circuit board via hole quality based on the photoelectric effect. According to the method, the quality of a via hole is determined by comparing the difference between the illumination intensity after a detected light source of a photoelectric sensor passes through a standard hole and the illumination intensity after the detected light of the photoelectric sensor passes through a to-be-detected hole, such as the hole position, hole diameter, hole blocked situation and the like, the to-be-detected circuit board is taken as an unqualified productwhen the difference between the illumination intensity of the to-be-detected hole in the to-be-detected circuit board and the illumination intensity of the standard hole in a standard circuit board isnot in the detection standard range; the to-be-detected circuit board is taken as a qualified product when the difference between the illumination intensity of the to-be-detected hole in the to-be-detected circuit board and the illumination intensity of the standard hole in a standard circuit board is in the detection standard range; and the to-be-detected circuit board is taken as qualified whenthe illumination intensity of the to-be-detected hole in the to-be-detected circuit board detected by the photoelectric sensor and the illumination intensity of the standard hole in the standard circuit board are in the detection standard range. The method has the advantages of wide application range, low cost, high inspection efficiency and short inspection time.
Description
technical field [0001] The invention relates to the technical field of circuit board detection, in particular to a method for detecting the quality of through holes of a circuit board based on the photoelectric effect. Background technique [0002] The quality problems of holes caused in the process of circuit board production are relatively common defects, such as under-drilling, under-drilling, and plugged holes. For products, the existing technology is to inspect the holes visually, but in the process of inspecting workpieces in large quantities, this inspection method takes a long time, has low inspection efficiency, and is easy to miss. Whether the probe can pass through the hole is a method to test whether the aperture is qualified, but only the printed board with the same specification and the same hole diameter can be tested, otherwise the test board must be remade according to the position of different holes. This inspection method is costly and the inspection effic...
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IPC IPC(8): G01N21/88
CPCG01N21/8806
Inventor 童雷童炳武童大望潘世丹
Owner 江门市利诺达电路科技有限公司