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Ceramic component block and cutting method thereof

A technology of ceramic components and cutting methods, which is applied in the field of MLCC and can solve the problems of lowering product quality and difficult separation of scraps

Pending Publication Date: 2019-03-19
广东微容电子科技有限公司
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  • Abstract
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a ceramic component block and a cutting method in view of the deficiencies of the prior art, so as to solve the problem that the leftover material is cut off in the prior art during the cutting process of the ceramic block, causing the leftover material to be difficult to cut. Separation and mixing into a large number of diced chips, reducing product quality issues

Method used

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  • Ceramic component block and cutting method thereof
  • Ceramic component block and cutting method thereof

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] See figure 1 , figure 1 It is a schematic structural view of a preferred embodiment of the ceramic element block provided by the present invention, as figure 1 As shown, a ceramic component block, which includes a block body 1, the block body includes a chip area 2 and an edge material area 3 arranged around the chip area 2, wherein, on the edge material area 3 Four cutting marking lines 4 are provided for marking cutting positions, and the four cutting marking lines 4 are sequentially connected in a pattern surrounding the chip area, and the pattern is concentric with the chip ...

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Abstract

The invention discloses a ceramic component block and a cutting method thereof. The ceramic component block comprises a block body, the block body comprises a chip area and an edge material area arranged around the chip area, the edge material area is provided with four cutting identification lines configured to identify cutting locations, the four cutting identification lines are connected end toend in order to form an area around the chip area, and the area is concentric with the chip area. Through arrangement of the four cutting identification lines, when the block body is cut, the edge material area cannot be completely cut off so as to rapidly separate the chip area from the edge material area to obtain a qualified chip.

Description

technical field [0001] The invention relates to the technical field of MLCC, in particular to a ceramic component block and a cutting method. Background technique [0002] For ceramic components such as MLCC (Multi-layer Ceramic Chip Capacitors, chip multilayer ceramic capacitors), the traditional cutting method is to fix the cutting blade on the cutter seat of the cutting machine, and place the semi-finished ceramic green body on the cutting machine platform. The photoelectric camera automatically recognizes the cutting line and automatically cuts the block in the Y-axis long direction. After cutting, the Y-axis automatic rotating platform cuts the block in the X-axis width direction, and separates the whole ceramic green body into individual capacitor chips (hereinafter referred to as products) . During the cutting process, the length of the blade is greater than or equal to the size of the block, so that the cutting chips and scraps are all cut off, so that when the scra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G2/24B28D1/22B28D7/04
CPCH01G2/24H01G4/30B28D1/22B28D7/046
Inventor 明全友向勇王强朱琪林显竣侯耀家
Owner 广东微容电子科技有限公司
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