Cutting chamfering machine

Abstract

The invention relates to a cutting chamfering machine. The cutting chamfering machine is characterized by comprising a rack, a transmission mechanism, a splitting mechanism and a chamfering mechanism;and the transmission mechanism is arranged on the rack, the splitting mechanism and the chamfering mechanism are located on the transmission mechanism and are arranged on the rack in sequence from front to back, the splitting mechanism is formed by a front power splitting cutter disc and a back power splitting cutter disc, the chamfering mechanism comprises two power grinding discs which are arranged in sequence in the transmission direction of the transmission mechanism, the two power grinding discs are inclined to the transmission surface of the transmission mechanism, and the inclined directions of the two power grinding discs are opposite. Compared with the prior art, the cutting chamfering machine has the advantages that movement is not needed, ceramic tiles or stones can be chamfered on the same machine after being split, and cracking can be reduced and even prevented in the condition that the processing speed is not influenced.

Description

Technical field: [0001] The invention relates to a ceramic / stone processing technology. Background technique: [0002] After the existing stone or tiles are cut, chamfering processing is often required. The existing technology is carried out on two machines, one of which cuts the tiles or stones, and then sends the cut tiles or stones to Go to the chamfering machine for chamfering. Because the two processes are separated and carried out on different machines, the efficiency is low, and, due to the large number of times of handling, it is easy to damage the cut tiles or stone materials during the handling process. In addition, the slitting of ceramic tiles or stones in the prior art is completed by a cutting knife. When a certain cutting speed needs to be guaranteed, the cutting blade needs to have a certain force to act on the tiles or stones. When the force is greater than the connecting force of the cut marks connecting the tiles on both sides, the cut marks will crack. ...

AI Technical Summary

Problems solved by technology

Since the two processes are separated and carried out on different machines, the efficiency is low. Moreover, due to the large number of handling times, it is easy to damage the cut tiles or stones during the handling process.

In addition, the slitting of ceramic tiles or stones in the prior art is completed by a cutting knife. When a certain cutting speed needs to be guaranteed, the cutting blade needs to have a certain force to act on the tiles or stones. When the force is greater than the connecting force of the cut marks connecting the tiles on both sides, the cut marks will crack. Since the cutting blade is circular, when the cutting knife cuts to the end of the tile or stone, the cut marks are angular. At this time, the The cut is the easiest to crack, and after the crack, the angular crack will form an irregular cut edge that does not meet the requirements

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