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Metal adhesion detection circuit and metal adhesion detection device

A detection device and detection circuit technology, which is applied in the detection field, can solve the problems of high requirements on the brightness of the light source, the color of the shrapnel bottom plate, material adhesion, and high cost, and achieve the effects of fast detection speed, cost reduction, and low cost

Inactive Publication Date: 2019-03-22
GOERTEK OPTICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production and assembly process of various electronic equipment, due to the small volume of metal materials such as shrapnel and circuit boards, material adhesion may occur during production and installation, resulting in misconduct.
At present, the detection of the adhesion of metal materials is mainly through photographing and zooming in. It mainly relies on visual detection, which has high cost, high requirements on the brightness of the light source and the color of the shrapnel bottom plate, and there is a risk of false detection.

Method used

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  • Metal adhesion detection circuit and metal adhesion detection device
  • Metal adhesion detection circuit and metal adhesion detection device
  • Metal adhesion detection circuit and metal adhesion detection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 As shown, the metal adhesion detection circuit includes a power supply 10 and two sets of probes 20 electrically connected to the positive and negative poles of the power supply 10 respectively, wherein a signal isolation device 11 is connected in series between one set of probes 20 and the power supply 10, and the probes 20 and the power supply 10 are respectively electrically connected to the two input terminals of the signal isolation device 11 , and the two output terminals of the signal isolation device 11 are electrically connected to the controller 12 . The two sets of probes 20 can be in contact with the two metal parts to be tested respectively at the same time. When the two metal parts to be tested contacted by the two groups of probes 20 are adhered and conducted, the current at the input end of the signal isolating device 11 forms a loop, and the two parts of the signal isolating device 11 The output end is closed, and a conduction signal is...

Embodiment 2

[0029] Such as figure 2 and image 3 Commonly shown, the detection device includes the metal adhesion detection circuit in Embodiment 1, and a power mechanism 31 for driving the probe 20 to contact the metal piece to be tested. The power mechanism 31 can drive the probe 20 for automatic detection, which has high reliability, reduces manpower, and improves detection efficiency. The power mechanism 31 is vertically arranged on the mounting plate 30, the mounting plate 30 is provided with a vertical guide rail 32, the slide block 33 of the guide rail 32 is provided with a probe mount 21 for installing the probe 20, the probe mount 21 Connected with the output shaft of the power mechanism 31 , the probe mount 21 can move up and down along the guide rail 32 driven by the power mechanism 31 , which can improve the detection accuracy. Wherein, the power mechanism 31 is a cylinder.

[0030] Such as figure 2 and image 3 As shown together, the mounting plate 30 below the probe m...

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Abstract

The invention discloses a metal adhesion detection circuit and a metal adhesion detection device, belonging to the technical field of detection. The detection circuit comprises a power supply and twosets of probes which are respectively and electrically connected with positive and negative poles of the power supply, wherein a signal isolation device is connected in series between one set of probeand the power supply; the probes and the power supply are respectively and electrically connected with two input ends of the signal isolation device; the two output ends of the signal isolation device are electrically connected with a controller; the two sets of probes can be respectively contacted with two metal pieces to be tested at the same time; when the two metal pieces to be tested are contacted with the two sets of probes and are conducted, the signal isolation device sends a conduction signal to the controller; the detection device comprises the metal adhesion detection circuit, anda power mechanism used for driving the probes to be contacted with the metal pieces to be tested. By adopting the design, the reliability of the adhesion detection of metal materials can be effectively improved, the detection cost of enterprises is lowered, and the detection efficiency is increased.

Description

technical field [0001] The invention belongs to the technical field of detection, and in particular relates to a metal adhesion detection circuit and a detection device. Background technique [0002] In the production and assembly process of various electronic equipment, due to the small size of metal materials such as shrapnel and circuit boards, material adhesion may occur during production and installation, resulting in misconduct. At present, the detection of the adhesion of metal materials is mainly through photographing and magnification detection, which mainly relies on visual detection, which has high costs, high requirements on the brightness of the light source and the color of the shrapnel bottom plate, and there is a risk of false detection. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a metal adhesion detection circuit and a detection device, which can effectively improve the reliability of detect...

Claims

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Application Information

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IPC IPC(8): G01N27/00
CPCG01N27/00
Inventor 张志强刘月良
Owner GOERTEK OPTICAL TECH CO LTD