Lens Fixture Mechanism for Automatic Coupling Package of Butterfly Diode Laser

Abstract

The invention discloses a lens fixture mechanism for automatic coupling and packaging of butterfly semiconductor lasers, and relates to the field of automatic coupling and packaging of electronic devices. The lens fixture mechanism includes a lens fixture position adjustment device and a lens fixture, the lens fixture is fixed on the lens fixture position adjustment device through a fixture adapter plate; the lens fixture is T-shaped as a whole, and one end of the lens fixture is provided with a lens adsorption hole, The other end of the lens fixture is provided with a suction pipe connection hole, and the suction pipe connection hole communicates with the lens adsorption hole from the inside of the lens fixture; through the suction pipe connected to the suction pipe connection hole, the lens adsorption hole A negative pressure is created, thereby attracting the lens to the holder. The lens fixture mechanism of the present invention can easily fine-tune the position of the lens fixture, and through the adjustment of multiple degrees of freedom, the lens can be placed in the laser more accurately; used in conjunction with the material tray mechanism, the angle of the lens can be adjusted conveniently and location.

Description

technical field [0001] The invention relates to the technical field of automatic coupling packaging, in particular to a lens fixture mechanism for automatic coupling packaging of butterfly semiconductor lasers. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoele...

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coupling, etc.

Therefore, how to solve the problems of low fiber coupling accuracy, high packaging cost, and low product qualification rate in the existing technology is the top priority in the development of butterfly semiconductor lasers.

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