A Butterfly Semiconductor Laser Automatic Coupling and Packaging Equipment

Abstract

The invention discloses a butterfly-shaped semiconductor laser automatic coupling packaging device and relates to the automatic coupling packing field of an electronic device. The automatic coupling packaging device includes a column, a cross beam, and a fiber clamp, a lens clamp mechanism, a lower clamp device and a material disc mechanism arranged on a base, and a laser power meter, wherein thefiber clamp, the lens clamp mechanism and a fiber automatic angle adjusting welding device can be adjusted in position to realize accurate coupling and packaging of a butterfly-shaped semiconductor laser. The device is advantaged in that the structure design is reasonable, the whole subsequent operation from coupling, alignment and packaging can be automatically completed, compared with a traditional hand-operated production line, advantages of high automatic degree, simple and convenient operation, high production efficiency, low production cost and stable product quality are achieved.

Description

technical field [0001] The invention relates to the technical field of automatic coupling and packaging, in particular to automatic coupling and packaging equipment for butterfly semiconductor lasers. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoelectronic de...

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coupling, etc.

Therefore, how to solve the problems of low fiber coupling accuracy, high packaging cost, and low product qualification rate in the existing technology is the top priority in the development of butterfly semiconductor lasers.

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