Interface unit, interface module with interface unit, and chip

Abstract

The present application provides an output interface unit, an interface module with the interface unit, and a chip. The output interface unit comprises a first D trigger, a second D trigger, a splitter, a first multiplexer and a second multiplexer. The present application also provides a corresponding input interface unit, an interface module with the interface unit, and a chip. The input interface unit comprises a third D trigger, a fourth D trigger, a fifth D trigger and a third multiplexer. The output interface unit and the input interface unit control, by means of controlling a signal value of a routing signal, output states and input states of the splitter and the multiplexers, so that two packaging modes can be adopted in the same output interface unit or input interface unit, i.e. the two packaging modes of the TSV and the MCM can be compatible with each other in the same output interface unit or input interface unit.

Description

technical field [0001] The present application relates to the technical field of integrated circuits, and in particular to an interface unit, an interface module and a chip having the interface unit. Background technique [0002] Chip packaging usually integrates multiple bare chips (DIE) with other components into a complete chip through a specific method. The main packaging methods include through silicon via technology (through silicon via, TSV) and multi-chip packaging technology (multi chip package, MCP) two. Among them, TSV refers to the packaging method that realizes the signal connection between different layers in the chip through perforation, and MCM refers to the packaging method that realizes the signal connection between different layers in the chip by expanding and superimposing the die. [0003] The schematic diagram of the longitudinal section structure of the chip obtained by TSV packaging is as follows: Figure 1a As shown, in this chip, a micro-bump layer...

AI Technical Summary

Problems solved by technology

[0008] The application provides an interface unit, an interface module and a chip with the interface unit, to solve the problem that the two packaging methods of TSV and MCM cannot use the same form of interface unit

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