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A semiconductor packaging device

A technology for packaging devices and semiconductors, applied in semiconductor devices, electric solid devices, electrical components, etc., can solve the problems of easy peeling off of glue, easy entry into chips, and poor photosensitive effect of chips, so as to improve photosensitive effect, reduce light refraction, Effect of reducing cleanliness requirements

Active Publication Date: 2021-02-19
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors of the present application have discovered during long-term research that, on the one hand, since the thickness of the transparent glass cover plate is generally thick, refraction, reflection and energy loss will occur when the light passes through the transparent glass, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover and the chip are connected by glue. After a long time of use, the glue is easy to fall off, and the external dust is easy to enter the photosensitive area of ​​the chip, which will affect the photosensitive effect of the chip.

Method used

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  • A semiconductor packaging device
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Embodiment Construction

[0024]The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application.

[0025]Seefigure 1 ,figure 1 This is a schematic flow diagram of an embodiment of the semiconductor chip packaging method of this application, and the packaging method includes:

[0026]S101: Provide a chip. The chip includes a front surface and a back surface. The front surface of the chip is provided with a photosensitive area and pads located around the photosensitive area, and a transparent protective layer is formed on the front surface of the chip. The...

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Abstract

The application discloses a semiconductor packaging device, the packaging device includes: a chip, the chip includes a front and a back, the front of the chip is provided with a photosensitive area and pads located around the photosensitive area; the chip corresponds to the The position of the pad is provided with a through hole, and the through hole corresponds to the pad one by one; a transparent protective layer is located on the front side of the chip and covers the photosensitive area of ​​the chip and the pad; a circuit board , to be electrically connected to the pad of the chip through the through hole. Through the above method, the present application can improve the photosensitive effect of the chip.

Description

Technical field[0001]This application relates to the field of semiconductor technology, in particular to a semiconductor package device.Background technique[0002]The chip with the photosensitive area is a very important part of the imaging device. To protect the photosensitive area of ​​the chip, the commonly used packaging method includes: adding a transparent glass cover above the photosensitive area of ​​the chip to protect the photosensitive area of ​​the chip.[0003]In the long-term research process, the inventor of the present application discovered that, on the one hand, because the transparent glass cover is generally thick, when light penetrates the transparent glass, refraction, reflection, and energy loss will occur, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover plate and the chip are connected by glue. After a long time of use, the glue is easy to fall off, and external dust is easy to enter the photosensitive ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/1462
Inventor 俞国庆
Owner NANTONG FUJITSU MICROELECTRONICS