96results about How to "Reduce the chance of disengagement" patented technology

The invention discloses a flexible MEMS resistance-reducing skin and a manufacturing method thereof used for reducing skin friction resistance during the advancing of on-water or underwater vehicles, which employs micro-fine resident bubbles to reduce resistance and belongs to the fields of micro-machinery and fluid dynamics. The upper surface of the skin is a surface layer coated with micro-pit arrays and processed by surface soakage; electrolytic anodes and cathodes of comb-shaped micro-fine planar metal, which are attached on an insulating layer, are arranged at the bottom of the micro-pits; a flexible substrate is positioned below the insulating layer; wire leading terminals for electrodes are arranged on the lower surface of the skin; and both the surface layer and the substrate are made by flexible materials. The overall thickness of the resistance reducing skin is at sub-millimeter level, and the skin is in the status of flexible film. The manufacturing method is an MEMS micro machining technique compatible with the flexible MEMS technology. The flexible MEMS resistance-reducing skin is coated on the outer surfaces of the on-water or underwater vehicles, with power thereof supplied by the on-water or under-water vehicles. Micro-bubbles stably residing in the micro-pits are formed by water electrolysis reaction to coat most parts of the surfaces of the on-water or under-water vehicles, thus realizing the function of reducing skin friction resistance.

The invention discloses a copper foil production conjoint machine and a high-bonding strength copper foil technology for a lithium ion battery. The copper foil production conjoint machine comprises a foil production machine and a post-treatment machine. The post-treatment machine is connected to the back of the foil production machine. A straight-line distance between a treatment tank copper foil input roller of the post-treatment machine and a copper foil stripping roller of the foil production machine is less than or equal to 3m. A rough treatment anode plate and a curing treatment anode plate are arranged along two surfaces of copper foil in a pre-treatment tank of the post-treatment machine. A post-treatment process comprises carrying out double-surface rough treatment, curing treatment, passivation treatment and washing treatment on copper foil which is fed by the foil production machine and has double-surface roughness vales of Rz less than 1.7 micrometers and Ra less than 0.25 micrometers. Through utilization of a copper sulphate solution as a roughing solution and a curing solution, the production flow is simplified; the control process is simple and can be operated simply; and a yield is improved. The copper sulphate solution does not contain an arsenic compound, reduces pollutant discharge, is conducive to environmental protection, and has obvious economic and social benefits.

The invention relates to the technical field of loudspeakers, and in particular relates to a miniature sounder and electronic equipment. The provided miniature sounder comprises a basin stand, a vibration system and a magnetic circuit system; the vibration system and the magnetic circuit system are fixedly connected to the basin stand; the vibration system comprises a voice diaphragm and a voice coil; the voice coil is fixed below the voice diaphragm, and used for driving the voice diaphragm to vibrate and produce sound; and the voice coil and the voice diaphragm are combined through injection moulding. The voice coil and the voice diaphragm of the miniature sounder provided by the invention are difficultly separated; and furthermore, the manufacturing process is relatively simple.

The invention provides a valve bag, belongs to the technical field of machinery, and solves the problem that conventional valve bags are prone to leakage during powder filling. The valve bag comprises a bag body with a bag opening and a valve port formed in the bag opening, wherein the valve port is tubular, and is formed through overlapping the two ends of a long flake-like connecting piece; the edge, near the end part of the bag body, of the valve port is bended outwards and in the axial direction of the valve port to form a first bending part; a second bending part with the orientation opposite to the first bending part is arranged at the bag opening of the bag body; a limiting groove is formed between the second bending part and the inner side wall of the bag body; the first bending part is positioned in the limiting groove; the second bending part leans against the first bending part, and is fixed to the first bending part through a bonding method; the second bending part and the bag body are an integral structure. The valve bag has the advantage that the leakproofness of the connection of the bag body and the valve port during the process of powder filling can be maintained.

The invention relates to gold stamping equipment, and relates to the technical field of printing. The gold stamping equipment comprises a rack and a gold stamping roller rotatably arranged on the rack; the rack is provided with a pressing device, the pressing device comprises a plurality of conveying rollers, conveying belts and a driving mechanism, and the conveying rollers are rotatably arranged on the rack; the conveying belts are arranged on the multiple conveying rollers in a sleeving manner and are used for pressing cloth and hot gold foil; and the driving mechanism is arranged on the rack and drives the conveying rollers to rotate. By means of the gold stamping equipment, the two conveying belts are used for pressing the cloth and the hot gold foil, so that the probability that the cloth is separated from the hot gold foil is reduced, the time that the cloth and the hot gold foil are attached together is prolonged, the probability that the hot gold foil is incompletely transferred during transfer printing is reduced, and the gold stamping quality of the cloth is improved.

The invention relates to a finger clip type glucometer with a light blocking function. The finger clip type glucometer comprises a body, a receiving device and a transmitting device. The transmittingdevice comprises a red light LED, an infrared light LED, a light blocking mechanism and a dust removing mechanism. The light blocking mechanism comprises a moving plate, a spring, an annular air bag,a control assembly and two inflation assemblies. The dust removing mechanism comprises a connecting rod, a connecting block and two cleaning rings. According to the finger clip type glucometer with the light blocking function, through the light blocking mechanism, the opening is blocked, external light is prevented from entering the main body and influencing the detection effect; through the dustremoving mechanism, dust removal work can be conducted on the red light LED and the infrared light LED, and the situation that dust adheres to the red light LED and the infrared light LED, and the detection effect is influenced is prevented.

The invention relates to the technical field of vehicle-mounted chargers, in particular to a multi-output USB charger which comprises a charging head, a shell, connecting grooves, USB interfaces and anti-falling mechanisms, the charging head is arranged at one end of the outer surface of the shell, and the connecting grooves are formed in the positions, close to the upper end and the lower end, of the side, away from the shell, of the outer surface of the charging head; the USB interfaces are arranged in the two sets of connecting grooves, the anti-falling mechanisms are arranged in the two sets of connecting grooves, each anti-falling mechanism comprises two sets of anti-falling assemblies, and movable grooves are formed in the upper ends and the lower ends of the sides, away from the USB interfaces, of the inner surfaces of the connecting grooves. And the anti-falling assemblies are in one-to-one correspondence with the movable grooves and are arranged in the movable grooves. According to the invention, the two groups of anti-falling assemblies are used for fixing a connecting line matched with the USB interfaces at the same time, and the probability that the connecting line is separated from the USB interfaces due to accidental touch is reduced, so that the attention of a driver during driving is concentrated, and the driving safety is improved.

A keycap is disposed on the plate of a keyboard. The keycap comprises a press surface, a hollow zone, a plate connection structure, a jig connection structure. The hollow zone is set on a side of the keycap opposite to the press surface. The plate connection structure is set in the hollow zone and used for connecting to the plate. The jig connection structure is connected to the jig when the keycap in a painting processing. Moreover, a keyboard and a jig for the keycap are also provided herein.

The invention relates to a novel thrust rod assembly. The novel thrust rod assembly comprises a first ball seat and a second ball seat. The first ball seat and the second ball seat are of cylinder structures. The first ball seat and the second ball seat are connected through a connecting pipe. The two ends of the connecting pipe gradually become larger in diameter and gradually become larger in wall thickness through upsetting, so that the two ends of the connecting pipe form concave-arc surfaces matched with the outer surfaces of the cylinder structures of the first ball seat and the second ball seat, and finally, form an integrated structure through welding. In the novel thrust rod assembly, the first ball seat and the second ball seat are of the cylinder structures, finish machining ofpipe fittings is directly adopted, forging is not needed, and the cost of materials is decreased by 30% while the quality is ensured; and meanwhile, the welding area of the first ball seat and the second ball seat is also increased by 30%, and the corresponding strength is also increased by 30%. The new structure of the novel thrust rod assembly solves the problems of the excessively large productmass and the excessively high machining cost, the probability of fracture and detachment is decreased, and the lightweight weight reduction need of a thrust rod is also ensured while the strength ofthe thrust rod is ensured.

The invention relates to a plastic steel refractory window. The plastic steel refractory window comprises a window frame, a fan Frame and double layer refractory glass, wherein the fan frame is arranged in the window frame, the double layer refractory glass is arranged in the fan frame, the fan frame comprises a fixing frame I and a clamping frame used for clamping the double-layer refractory glass, the fixing frame I comprises a middle frame I, a connecting frame I and a connecting frame II, the connecting frame I and the connecting frame II are located on the two sides of the middle frame Ifacing an outdoor side edge, a supporting plate I is arranged between the clamping frame and the connecting frame I, the edge of the double layer refractory glass is clamped in a U-shaped opening of the supporting plate I, a plurality of middle frame heat insulation cavities are formed in the middle frame I, supporting plates II attached to the cavity wall are arranged in the middle frame heat insulation cavities, fire-resistant expansion strips are arranged in the middle frame heat insulation cavities which are not provided with the supporting plates II, a window frame heat insulation cavityI is formed in the window frame, and a supporting part I in a square tubular structure is arranged in the window frame heat insulation cavity. The plastic steel refractory window is good in fireproofperformance, and can have a certain blocking effect on smoke.

The invention discloses a semiconductor chip packaging method. The method includes the steps: providing a chip, wherein the chip includes the front surface and the back surface, and the front surfaceof the chip is provided with a photosensitive area and bonding pads located around the photosensitive area; forming a transparent protective layer on the front surface of the chip, wherein the transparent protective layer covers the photosensitive region of the chip and the bonding pads; forming through holes in the back surface of the chip, and enabling the bonding pads to be exposed out of the through holes; enabling the bonding pads of the chip to be electrically connected with a circuit board through the through holes. Through the above manner, the method can improve the light sensing effect of the chip.

The invention discloses a numerical control machine tool facilitating separation and collection of waste residues. The numerical control machine tool comprises a machine body shell provided with a protection door through a slide groove; a waste residue separation mechanism is installed at the bottom of one side of the machine body shell; and a containing cavity is formed in the bottom end of the machine body shell and internally provided with a containing board. The numerical control machine tool is scientific and reasonable in structure and safe and convenient to use, the waste residues slideout from the surface of a discharging board through a bearing gauze element, cooling waste liquid falls down through the bearing gauze element and then is drained through a drain pipe, separation between the waste residues and the cooling waste liquid is achieved, and the situations of environmental pollution and drainage pipeline blocking caused when the cooling waste liquid and the waste residues are drained at the same time are avoided; and when the protection door moves, a mounting rod circularly swings, so that a cleaning brush installed on one side of the mounting rod cleans the surfaceof a piece of observation glass through a brush outlet, stained cooling water waste liquid on the inner side of the observation glass is cleaned away effectively, and the observation clarity of the observation glass is improved.

The invention discloses a semiconductor chip packaging method. The method includes the steps: providing a chip, wherein the chip includes the front surface and the back surface, and the front surfaceof the chip is provided with a photosensitive area and bonding pads located around the photosensitive area, and the sides, backing on to the chip, of the bonding pads are provided with metal parts; forming a transparent protective layer on the front surface of the chip, wherein the transparent protective layer covers the photosensitive region of the chip and the metal parts, and the transparent protective layer is provided with openings corresponding to the positions of the metal parts, so as to enable the first ends, far from the bonding pads, of the metal parts to be exposed from the openings; electrically connecting the first ends of the metal parts and a circuit board through a folded plate with the conductivity, so as to electrically connect the chip to the circuit board. Through theabove manner, the method can improve the light sensing effect of the chip.

The modular furniture splicing fixture is characterized in that: it includes a plug-in board and a lock that cooperates with the plug-in board; the plug-in board has a main body; and the main body extends at least two Ribs; at least one lock hole is provided at the edge of each rib, and each lock hole is provided with a lock; the lock includes a cap that helps to twist the lock and a cap that prevents the lock from falling off The baffle of the flashboard is provided with lock teeth between the cap body and the baffle; the ribs are inserted between the cap body and the baffle, and the lock teeth only enter the lock hole through the lock with the smallest size, and screw The rear lock teeth of the cap body are displaced, and the lock buckle is fixed on the insert plate. The present invention is mainly applied to the splicing and fixing of modular furniture, and has the advantages of simple structure, convenient assembly and disassembly, reusability, high fixing strength, and stable fixing.

The invention relates to the technical field of glass production and discloses a glass bottle turning mechanism. The glass bottle turning mechanism comprises a grooved wheel and a rotary disk driven by a driving part. A locking disk matched with the grooved wheel is coaxially and fixedly mounted on the rotary disk. A cylindrical pin used for pushing the grooved wheel to rotate is arranged in the position, deviating from the circle center, of the rotary disk. The lower portion of the grooved wheel is rotatably connected with a supporting disk. The supporting disk is provided with a plurality ofnegative pressure holes in the circumferential direction. An enclosing disk rotatably connected with the supporting disk is arranged under the supporting disk. The enclosing disk is provided with anair hole communicating with the corresponding negative pressure hole. The air hole communicates with a negative pressure assembly. The periphery of the supporting disk is fixedly connected with a guide plate. The guide plate is provided with a feed port and a discharge port. The glass bottle turning mechanism is simple in structure and can carry out turning on glass bottles to adapt to turning transportation of the glass bottles.

The invention discloses a semiconductor chip packaging method. The method includes the steps: providing a chip, wherein the chip includes the front surface and the back surface, and the front surfaceof the chip is provided with a photosensitive area and bonding pads located around the photosensitive area, and the sides, backing on to the chip, of the bonding pads are provided with metal parts; forming a transparent protective layer on the front surface of the chip, wherein the transparent protective layer covers the photosensitive region of the chip and the metal parts, and the transparent protective layer is provided with openings corresponding to the positions of the metal parts, so as to enable the first ends, far from the bonding pads, of the metal parts to be exposed from the openings; electrically connecting the first ends of the metal parts and a circuit board through wires, so as to electrically connect the chip to the circuit board. Through the above manner, the method can improve the light sensing effect of the chip.

The invention provides a welding structure for an LED (light-emitting diode) array and a circuit board thereof. The welding structure comprises at least one welding hole, wherein the welding hole penetrates through a first surface and a second surface of the circuit board, the welding hole forms a first aperture on the first surface and forms a second aperture on the second surface, and the first aperture is smaller than the second aperture. According to the welding structure disclosed by the invention, the first aperture formed by the welding hole on the first surface of the circuit board is smaller than the second aperture formed on the second surface of the circuit board, so that the inner section of the welding hole is shaped like a trapezoid or the like, and when a power cord is inserted into the welding hole, the electrical connection between the power cord and the welding hole is more stable and more reliable in comparison with the surface-mounting connection way in the prior art. In addition, action force required for separating the power cord from a PCB (printed circuit board) can be increased by a soldering tin part and a sealing adhesive part on the inner section of the welding hole, so that the incidence of separating the power cord from the PCB can be reduced, and the working reliability of a backlight module can be enhanced.

It is an object of the present invention to provide a pusher guidewire in which a coil has a free rear end that is not fixed to a core shaft, thereby allowing a stent that has been partially deployed from the front end of a catheter to be retrieved into the catheter. In a pusher guidewire (1, 1a, 1b, 1c, 1d), a front end coil (14, 64, 74, 84, 94) has a free rear end (14a, 64a, 74a, 84a, 94a) that is not fixed to a first front end portion (12a) of a core shaft (12). By pulling the core shaft toward the rear end, the free rear end catches a gap (10a) of a partially-deployed stent (10). By rotating the core shaft in this state, a front end portion (11) of the stent deployed from a front end opening (24) of a catheter (2) is wrapped around the outer circumference of the front end coil. Further pulling the core shaft toward the rear end with the wrapped stent retrieves the partially-deployed stent into the catheter, thereby preventing the stent from damaging the inner wall of a normal blood vessel.

The invention relates to a convenient ground earth drill with a rotation speed regulating function. The convenient ground earth drill comprises a main body and a drill bit, and further comprises a speed regulating mechanism and a dismounting mechanism, wherein the dismounting mechanism comprises a drive shaft, a first connecting disc, a second connecting disc, a first sleeve, a second spring, twofirst bearings and at least two connecting assemblies; the speed regulating mechanism comprises a transmission block, a friction disc, a motor and two movable assemblies; each connecting assembly comprises a through hole, a lead screw, a second bearing and a fourth sleeve; and each moving assembly comprises a third sleeve, a gas cylinder, a first slide rod and two resisting units; each resisting unit comprises a second slide rod, a second sleeve and a first spring. In the convenient ground earth drill with the rotation speed regulating function disclosed by the invention, the rotation speed ofthe drill bit can be regulated through the regulating mechanism, so that practicability of the earth drill is improved; and the dismounting mechanism improves drill bit replacement convenience, and improves convenience of earth drill use.

The invention discloses a semiconductor packaging device, and the packaging device comprises: a chip which comprises a front surface and a back surface, wherein the front surface of the chip is provided with a photosensitive region and a bonding pad located at the periphery of the photosensitive region; a metal piece which is positioned on one side, back to the chip, of the bonding pad; a transparent protective layer which is located on the front face of the chip and covers the photosensitive area of the chip, wherein the surface of the first end, away from the chip, of the metal piece is exposed out of the transparent protective layer; a circuit board which is positioned on the back surface of the chip; and a conductive connecting piece which is electrically connected with the surface ofthe first end, exposed out of the transparent protective layer, of the metal piece and the circuit board, so that the chip is electrically connected with the circuit board. In this way, the photosensitive effect of the chip can be improved.

The invention relates to a cover board structure which comprises a cover board and a plurality of snapping components. The cover board is provided with an external surface and an internal surface. The snapping components are connected with the cover board, and furthermore each snapping component extends from the internal surface to the external surface. The invention further provides an electronic device with the cover board structure. According to the cover board structure, the cover board and a display module are assembled in a detachable manner, thereby improving convenience in assembling and maintenance of the electronic device.

The invention relates to a bridge crane with safer utilization and wider applicability. The bridge crane comprises a longitudinal main beam and a cross beam, wherein the cross section of the longitudinal main beam and the cross beam are in an I-shaped shape, the longitudinal main beam is fixedly assembled on a supporting carrier, and the cross beam is slidably assembled below the longitudinal main beam through a longitudinal traveling frame; the cross beam is provided with an extending beam, the extending beam is assembled below the cross beam in a sliding mode through transverse traveling frames, and the extending beam is provided with a lifting trolley used for lifting a lifting object; the longitudinal traveling frame and the transverse traveling frames respectively comprise a mounting frame, walking wheels, limiting wheels and a walking motor; and the limiting wheels slides along the extending direction of the length of a connecting wall plate in a rolling-contact manner, and the limiting wheels are used for limiting the mounting frames to shift along the width direction of s bottom plate. According to the bridge crane, through traveling and stretching operation of the extending beam, the bridge crane can expand the walking range of the lifting trolley in the extending direction of the cross beam by spanning supporting columns on a construction site, the separation probability of the traveling frames is effectively reduced, operation is safer, and the noise pollution is reduced.

The invention provides a photovoltaic metal bottom plate, a photovoltaic roof piece and a preparation method of the photovoltaic roof piece. The photovoltaic metal bottom plate comprises a groove bottom part and two side wall parts, wherein the two side wall parts are arranged on two opposite side edges of the groove bottom part respectively to form a mounting groove; a contact baffle is arrangedalong the length direction of the side wall parts; one side of the contact baffle is connected with the side wall parts and the other side of the contact baffle extends towards one side, far away fromthe side wall parts; and a first pre-set distance is formed between the contact baffle and the groove bottom part. According to the photovoltaic metal bottom plate, the contact baffle increases the bonding area between a filling layer and the mounting groove of the photovoltaic metal bottom plate; and the contact baffle has a limiting effect on the filling layer and the separation probability ofthe filling layer and the mounting groove is reduced, so that the separation probability of a photovoltaic module mounted in the photovoltaic metal bottom plate is reduced.

The invention discloses a circuit board and a manufacturing method of the circuit board. The manufacturing method of the circuit board comprises the steps of forming an external insulating layer on a substrate, and forming a pre-gelatinized layer and a metal layer on the external insulating layer, wherein the pre-gelatinized layer is located between the metal layer and the external insulating layer, the metal layer is provided with a contact surface touching the pre-gelatinized layer, and the average roughness of 10 points of the contact surface is 1-4 microns; and then, forming at least one pore in the metal layer; forming a conductive layer covering the metal layer and all surfaces of the pore; forming a metal column in the pore after forming the conductive layer; forming a metal pattern layer touching and locally covering the conductive layer above the metal layer; and removing part of the metal layer and part of the conductive layer exposed by the metal pattern layer to form an external circuit layer. The invention further provides a circuit board manufactured by the method.

The invention relates to a computer with a power line reinforcing function. The device comprises a main body, power connectors, power interfaces and cables, the device further comprises a fixing mechanism and an emergency mechanism. The fixing mechanism comprises a connecting rod, a supporting rod, a reinforcing assembly, two fixing sleeves, two springs and two fixing rods. The emergency mechanismcomprises a sealing sleeve, a push rod, a torsion spring, an installation bearing, a telescopic column, a rotary disc, a first sliding groove, a second sliding groove and a sliding block. The reinforcing assembly comprises two supporting sleeves, two clamping plates and two hook-and-loop fasteners. The invention discloses a computer with a power line reinforcing function. The cable can be fixed through the fixing mechanism, the probability that the cable connector is separated from the cable interface is reduced, the working stability of a computer is improved, the cable connector and the cable interface can be disconnected through the emergency mechanism, the computer can be powered off in time in an emergency state, and the emergency protection function on the computer is achieved.

The present application discloses a semiconductor package device, and the package device comprises a chip which includes a front surface and a back surface, wherein the front surface of the chip is provided with a photosensitive area and a plurality of bonding pads located around the photosensitive area, the chip is provided with through holes which are corresponding to the positions of the plurality of the bonding pads, and the plurality of the bonding pads of the chip are exposed from the through holes; a transparent protective layer which is located on the front surface of the chip and covers the photosensitive of the chip and the plurality of bonding pads; and a circuit board which is electrically connected to the plurality of the bonding pads of the chip through the through holes. Through the above manner, the device can improve the light sensing effect of the chip.

The invention relates to the technical field of precoated sand molds, in particular to a precoated sand mold for casting a stainless steel thin-walled workpiece. The mold comprises a supporting plate, the supporting plate is of a U-shaped structure, an air cylinder is arranged on the outer surface of one side of the supporting plate, and a movable plate is fixedly connected to the outer surface of the other side of the air cylinder; and a movable groove is formed in the center of the outer surface of one side of the movable plate, a clamping plate is slidably connected to the interior of the movable groove, a cleaning brush is arranged on the outer surface of the other side of the clamping plate, a connecting groove is formed in the center of the outer surface of the upper end of the supporting plate, and a storage groove is clamped to the interior of the connecting groove. According to the mold, due to the fact that the movable groove and the T-shaped structure are matched in structure, and a bearing is arranged inside the clamping plate, a user can conveniently clamp and fix the precoated sand mold for casting the stainless steel thin-walled workpiece, and after casting of the stainless steel thin-walled workpiece is completed, the user can conveniently clean and collect fallen precoated sand, the production cost of the user is reduced, and the use efficiency of the device is improved.

The invention relates to a bridge pier underwater surface attachment washing system and a robot with an improved structure, and belongs to the technical field of underwater operation robots. The underwater operation robot comprises a rack, a flexible crawler, a propeller, negative pressure cyclone adsorption devices and an operation system, wherein the flexible crawler is an annular rubber belt provided with a plurality of through holes; the negative pressure cyclone adsorption devices located in an inter-belt space of the flexible crawler are arranged in each side of the rack, and adsorptionopenings of the negative pressure cyclone adsorption devices are formed in the through holes in a penetrating mode to generate an adsorption force on the surface of an operation place; the two or morenegative pressure cyclone adsorption devices which are arranged at intervals are arranged in the inter-belt space on the same side; the two or more negative pressure cyclone adsorption devices are arranged at intervals in the extending direction; and in the traveling process, the one or above adsorption openings are always exist to completely be covered by the through holes. The robot is suitablefor operating the surface of a non-steel structure, and the robot can be widely applied to the fields such as bridge pier surface washing, and flaw detection.

The invention discloses a semiconductor packaging device, and the semiconductor packaging device comprises a chip which comprises a front surface and a back surface, wherein the front surface of the chip is provided with a photosensitive area and a plurality of bonding pads located around the photosensitive area, and the chip is provided with through holes which are corresponding to the positionsof the plurality of the bonding pads in a one-to-one manner; a transparent protective layer which is located on the front surface of the chip and covers the photosensitive of the chip and the plurality of bonding pads; and a circuit board which is electrically connected to the plurality of the bonding pads of the chip through the through holes. Through the above manner, the device can improve thelight sensing effect of the chip.