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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which can be applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problems of reducing the reliability of the circuit board, detaching the outer circuit layer, and weakening the peeling strength.

Inactive Publication Date: 2013-03-06
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the line width of the circuit board shrinks, the peeling strength (peeling strength) between the outer circuit layer and the outer insulating layer connected thereto will generally weaken, causing the outer circuit layer to be easily detached from the outer insulating layer, thereby Reduce the reliability of the circuit board (reliability)

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0035] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, the specific implementation, structure, method, steps, Features and their functions are described in detail below.

[0036] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. Through the description of specific embodiments, it should be possible to obtain a deeper and more specific understanding of the technical means and effects of the present invention to achieve the intended purpose, but the attached drawings are only for reference and description, and are not used to explain the present invention limit.

[0037] Figure 1A to Figure 1H It is a schematic cross-sectional flow diagram of a manufacturing method of a circuit board according to an embodiment of the present i...

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Abstract

The invention discloses a circuit board and a manufacturing method of the circuit board. The manufacturing method of the circuit board comprises the steps of forming an external insulating layer on a substrate, and forming a pre-gelatinized layer and a metal layer on the external insulating layer, wherein the pre-gelatinized layer is located between the metal layer and the external insulating layer, the metal layer is provided with a contact surface touching the pre-gelatinized layer, and the average roughness of 10 points of the contact surface is 1-4 microns; and then, forming at least one pore in the metal layer; forming a conductive layer covering the metal layer and all surfaces of the pore; forming a metal column in the pore after forming the conductive layer; forming a metal pattern layer touching and locally covering the conductive layer above the metal layer; and removing part of the metal layer and part of the conductive layer exposed by the metal pattern layer to form an external circuit layer. The invention further provides a circuit board manufactured by the method.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board with a primer and a manufacturing method thereof. Background technique [0002] Today's circuit boards, especially high density interconnection boards (High Density Interconnection Board, HDI Board), are developing towards a trend of thinner wires. Therefore, many manufacturers of circuit boards study how to reduce the line width of circuit boards to increase circuit density. However, when the line width of the circuit board shrinks, the peeling strength (peeling strength) between the outer circuit layer and the outer insulating layer connected thereto will generally weaken, causing the outer circuit layer to be easily detached from the outer insulating layer, thereby Reduce the reliability of the circuit board. Contents of the invention [0003] The invention provides a manufacturing method of a circuit board, which uses a pre-glue layer t...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
Inventor 余丞博黄培彰林爱华黄瀚霈
Owner UNIMICRON TECH CORP
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