Polishing liquid supply system, method and polishing system
A technology of supplying system and polishing liquid, applied in surface polishing machine tools, grinding/polishing equipment, control of workpiece feed movement, etc., can solve the problems of high supply pressure of polishing liquid supply system, etc. pressure, the effect of improving the overall quality
Active Publication Date: 2021-08-31
XIAN ESWIN SILICON WAFER TECH CO LTD
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Problems solved by technology
[0004] The embodiment of the present invention provides a polishing liquid supply system, method and polishing system, which solves the problem of excessive supply pressure of the existing polishing liquid supply system
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[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0043] see figure 1 , the embodiment of the present invention provides a polishing liquid supply system, including: a central supply subsystem 1 and an equipment end supply subsystem 2;
[0044] Among them, the central supply subsystem 1 communicates with the equipment supply subsystem 2 through the first pipeline 31; when the central supply subsystem 1 receives the supply request sent by the equipment supply subsystem 2, the central supply subsys...
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Embodiments of the present invention provide a polishing liquid supply system, method, and polishing system. The polishing liquid supply system includes: a central supply subsystem and an equipment-side supply subsystem, wherein the central supply subsystem and the equipment-end supply subsystem pass through a first The pipeline is connected; when the central supply subsystem receives the supply request sent by the equipment-side supply subsystem, the central supply subsystem supplies the polishing stock solution to the equipment-side supply subsystem; the equipment-side supply subsystem mixes the polishing stock solution and additives to obtain a polishing solution, and The polishing liquid is supplied to the polishing equipment. In the embodiment of the present invention, raw solution supply and raw solution mixing are performed separately by dividing subsystems, which not only relieves the pressure of raw solution supply, but also facilitates centralized control of raw solution mixing, and improves the overall quality of the polishing process.
Description
technical field [0001] The embodiments of the present invention relate to the field of silicon wafer processing, in particular to a polishing liquid supply system, method and polishing system. Background technique [0002] During the operation of the polishing equipment, it is necessary to continuously provide polishing liquid to the silicon wafer. The equipment uses the polishing liquid to remove the silicon dioxide film on the surface of the silicon wafer, and then the alkaline solution reacts with the exposed single crystal silicon on the surface of the silicon wafer to produce silicate. The equipment The silicate on the surface of the silicon wafer is removed by the polishing pad and the polishing liquid, and the new single crystal silicon on the surface of the silicon wafer is exposed, and then the reaction is carried out until the silicon wafer has a high flatness. During the whole process, the demand for polishing fluid is large and the quality requirements are high. ...
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IPC IPC(8): B24B29/02B24B57/02B24B49/00
CPCB24B29/02B24B49/00B24B57/02
Inventor 李昀泽具成旻崔世勋白宗权
Owner XIAN ESWIN SILICON WAFER TECH CO LTD