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Ball placement device and method

A ball planting and solder ball technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inability to meet the needs of various substrate planting and high cost, shortening the R&D and production cycle, and making production convenient and fast. , the effect of improving production efficiency

Active Publication Date: 2019-04-05
BEIJING INST OF RADIO MEASUREMENT
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AI Technical Summary

Problems solved by technology

[0003] At present, for the ball planting of substrates, special ball planting devices or equipment are usually used for ball planting according to the needs, and special devices need to be made for ball planting according to different products, resulting in high cost and unable to meet the ball planting of various substrates of enterprises need

Method used

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  • Ball placement device and method

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Embodiment Construction

[0021] The principles and features of the present invention will be described below in conjunction with the accompanying drawings. The examples cited are only used to explain the present invention, and are not used to limit the scope of the present invention.

[0022] The ball planting device of this application consists of a placement machine, such as figure 1 As shown, it is a schematic diagram of the structure of the circuit part provided by the embodiment of the ball planting device of the present invention. A datacon 2200 placement machine can be used. The placement machine includes: a dipping tray 1, a scraper 2, a suction nozzle 3, a motor, The drive belt, the squeegee height adjuster, the patch location and the main control module 4, an image sensor 5 is arranged above the glue dipping tray 1, and a plurality of concave holes 11 arranged according to preset rules are arranged in the glue dipping tray 1. The motor and The rubber dipping discs 1 are connected by a transmissi...

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Abstract

The invention discloses a ball placement device and method, and relates to the field of chip fabrication. The ball placement device is composed of a placement machine, and the placement machine comprises a patch, a silicone disc, a scraper, a nozzle and a main control module. An image sensor is arranged at the upper portion of the silicone disc, and a plurality of concave holes are arranged in thesilicone disc according to a preset rule. The ball placement device reconstructs the silicone disc of the automatic chip placement machine to achieve the functions of the ball placement with no needfor extra purchasing of special devices for ball placement and manufacturing of special ball placement tools to allow the production of the three-dimensional multi-chip module to be more convenient and rapid so as to shorten the development and production periods, avoid the tedious work of manual placement of welded balls and improve the production efficiency.

Description

Technical field [0001] The present invention relates to the field of chip manufacturing, in particular to a ball planting device and method. Background technique [0002] In a three-dimensional multi-chip assembly, the stack between the substrate and the substrate is generally connected by solder balls. [0003] At present, for the planting of substrates, a special planting device or equipment is usually used to plant the balls according to the needs. For different products, special devices need to be made for planting the balls, which leads to high costs and cannot meet the needs of enterprises for planting multiple substrates. demand. Summary of the invention [0004] The technical problem to be solved by the present invention is to provide a planting ball device and a planting ball method in view of the deficiencies of the prior art. [0005] The technical solutions of the present invention to solve the above technical problems are as follows: [0006] A planting ball device, cons...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/67
CPCH01L21/4846H01L21/67259
Inventor 霍文培杨义松刘文治
Owner BEIJING INST OF RADIO MEASUREMENT
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