A laser emitting component and corresponding optical module

Abstract

The invention discloses a laser emission assembly and a corresponding optical module. The laser emission assembly comprises a ceramic tube casing, and the bottom of the ceramic tube casing is providedwith pins and a metalized structure electrically connected with the pins; the laser emission assembly further comprises a transition block arranged in the ceramic tube casing and provided with one ormore laser chips; and the laser chip is electrically connected with the pin via the metalized structure to receive a control signal. There is a difference between the height of the upper surface of the metalized structure and that of the upper surface of the transition block, and the difference is within a preset range. The laser chips are connected with the pins of the ceramic tube casing via the metalized structure, the performance of the laser emission assembly in a wider temperature range can be ensured, the high-frequency characteristic of the assembly is improved, and the reliability ofthe assembly is also improved.

Description

technical field [0001] The invention belongs to the technical field of optical communication, and more specifically relates to a laser emitting component and a corresponding optical module. Background technique [0002] In recent years, with the development of the Internet, the density of light emitting units is getting higher and higher, and the requirements for speed are getting higher and higher, and it is often hoped to produce products with better performance at a lower cost. Especially the application of 5G technology also has higher requirements on the wide temperature characteristics and reliability of laser emitting components. [0003] At present, laser emission components can be produced based on COB (chip On board, COB for short) technology, but the laser emission components produced by this method are sensitive to temperature changes, have poor wide temperature characteristics, and poor high frequency characteristics. Difference. Moreover, the reliability is l...

AI Technical Summary

Problems solved by technology

[0006] In view of the above defects or improvement needs of the prior art, the present invention provides a laser emitting component and a corresponding optical module, the purpose of which is to establish a connection between the laser chip and the pins of the ceramic shell by using a metallization structure, so as to ensure that the laser emitting component The performance when working in a wide temperature range, and improve the high-frequency characteristics of the laser emitting components, improve the reliability of the laser emitting components, thereby solving the problem of poor wide-temperature characteristics of the current laser components, poor high-frequency characteristics, and reliability poor technical issues

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