How to make a thin antenna circuit board
An antenna circuit and manufacturing method technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit and other directions, can solve the problems of high process accuracy requirements, long labor hours, etc., so as to reduce the cumulative alignment tolerance and reduce pressure. The effect of the combined process
Active Publication Date: 2019-09-20
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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However, the above method has high requirements on the precision of the manufacturing process and takes a long time
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[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0048] Some embodiments of the present invention will be described in detail below in conju...
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Abstract
A method for manufacturing a thin antenna circuit board, comprising the following steps: providing two single-sided substrates, each single-sided substrate includes a first insulating layer and a copper layer covering one surface of the first insulating layer, and each A single-sided substrate further includes a first through hole penetrating through the first insulating layer and exposing the copper layer, and a first conductive structure filling the first through hole; an intermediate structure is provided, which includes sequentially The circuit layer, the third insulating layer, the metal shielding layer, the second insulating layer and another circuit layer are laminated, each circuit layer includes at least one signal line and at least one connection pad, and the above intermediate structure also includes at least one through The electrical connection structure of the connection pad, the second insulating layer, the metal shielding layer and the third insulating layer is used to electrically connect the connection pads on the two circuit layers of the intermediate structure; the intermediate structure is arranged on The two single-sided substrates are pressed together to obtain a thin antenna circuit board.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a thin antenna circuit board. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and light, thin and small electronic products are becoming more and more popular. As the main component of electronic products, flexible circuit boards occupy a large space of electronic products. Therefore, the volume of flexible circuit boards affects the volume of electronic products to a large extent. , Thin, short and small trends. [0003] When the lines in the circuit board are conducting signal conduction, they are easily interfered by external signals or other line signals. In the prior art, when making a multi-layer circuit board, an independent shielding layer is bonded to an independent line to reduce the interference of other lines or external signals on the line. However, the above-mentione...
Claims
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IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0218H05K3/4614H05K3/4623H05K2201/096H05K3/0094H05K3/4617H05K3/4661H05K3/4611H05K3/462Y10T29/49126
Inventor 沈芾云何明展徐筱婷高琳洁
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD