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A double-layer dielectric adhesive-free flexible copper clad laminate

A technology for adhesive flexible and copper clad laminates, applied in the field of double-layer dielectric non-adhesive flexible copper clad laminates, can solve the problems of reducing the thickness of non-adhesive flexible copper clad laminates, low product dimensional stability, and difficult processing, saving raw materials, Good appearance and performance, high peel strength effect

Active Publication Date: 2018-01-05
CHENGDU DO ITC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide a double-layer dielectric adhesive-free flexible copper-clad laminate, the structure of which is reduced from five layers to four layers, which reduces the thickness of the adhesive-free flexible copper-clad laminate, saves materials, and simplifies the manufacturing process. can be 350 o The high temperature pressing temperature of C is reduced to 120-220 o C, saving energy consumption; at the same time, the present invention overcomes the problem of the brittleness of the adhesive-free flexible copper clad laminate when the medium between the copper foils is two layers of thermosetting polyimide in the prior art, and the medium layer is thermosetting polyimide Imide / TPI glue / thermosetting polyimide / timely thickness leads to problems such as processing difficulties, when the dielectric layer is TPI glue / thermosetting polyimide / TPI glue, there is delamination and explosion, and the size of the product is stable during downstream processing issues of low sex

Method used

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  • A double-layer dielectric adhesive-free flexible copper clad laminate
  • A double-layer dielectric adhesive-free flexible copper clad laminate
  • A double-layer dielectric adhesive-free flexible copper clad laminate

Examples

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Embodiment 1

[0045] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0046] In this embodiment, the thicknesses of the first copper foil 1 and the second copper foil 4 are respectively 7 μm; the thickness of the thermoplastic polyimide layer 2 is 1 μm; the thickness of the polyimide structure film layer 3 is 5 μm;

[0047] The total thickness of the copper clad laminate in this embodiment is 20 μm, which is suitable for electronic products with high thickness requirements, such as mobile phones and other fields.

Embodiment 2

[0049] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0050] In this embodiment, the thicknesses of the first copper foil 1 and the second copper foil 4 are respectively 12 μm; the thickness of the thermoplastic polyimide layer 2 is 3 μm; the thickness of the polyimide structure film layer 3 is 10 μm; in this embodiment The total thickness of the copper clad laminate is 37 μm.

Embodiment 3

[0052] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0053] In this embodiment, the thickness of the first copper foil 1 and the second copper foil 4 is 35 μm; the thickness of the thermoplastic polyimide layer 2 is 7 μm; the thickness of the polyimide structure film layer 3 is 15 μm; the copper clad laminate of this embodiment The total thickness is 92 μm.

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Abstract

The invention provides a double-layer dielectric glue-free flexible copper-clad laminate, which is composed of a first copper foil, a second copper foil arranged in parallel, and an insulating layer between the first copper foil and the second copper foil. The insulating layer Including thermoplastic polyimide layer and polyimide structural film layer. This flexible copper-clad laminate structure reduces the thickness, saves materials, and reduces the manufacturing process. At the same time, it ensures the dimensional stability of the copper-clad laminate and the dimensional stability of the printed circuit board during downstream processing. It has excellent overall performance, is thinner, and can The need to realize thin electronic products.

Description

technical field [0001] The invention relates to a flexible copper-clad laminate, in particular to a double-layer dielectric adhesive-free flexible copper-clad laminate. Background technique [0002] Flexible Copper Clad Laminate (Flexible Copper Clad Laminate, abbreviated as FCCL) refers to an insulating substrate (polyimide film, polyester film or polynaphthyl film, etc.) covered with copper foil, which can be bent repeatedly. The flexible printed circuit board (FPCB) made of thin sheet composite materials can meet the requirements of lightness, thinness, shortness and miniaturization of electronic equipment. The main uses are as follows: computer peripherals and displays, aircraft instruments, navigation and positioning devices, Oil exploration equipment, missile tracking instruments, artificial satellites, space shuttles and spaceships, police wireless telephones, camcorders and digital cameras, medical electronic products, circuit board busbars. [0003] According to th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20
CPCB32B15/01B32B15/20B32B2250/04B32B2255/06B32B2255/26B32B2307/202B32B2307/306B32B2307/3065B32B2307/558B32B2307/734B32B2457/08
Inventor 杨刚
Owner CHENGDU DO ITC NEW MATERIAL