Lamination process of multi-layer soft-rigid board with thickened photosensitive film
A technology of flexible and rigid boards and photosensitive films, which is applied in the direction of multilayer circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of increasing process, production cycle and cost, and easy deviation of graphics, so as to reduce process and production cycle , reduce the pressing process, and ensure the effect of leveling
Active Publication Date: 2019-01-15
高德(江苏)电子科技股份有限公司
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] For non-Ari-gap-designed multi-layer soft printed circuit soft-rigid boards, the general lamination method is to first press the multi-layer flexible boards first, and at the same time press the bent parts of the soft boards together, and then press them with other hard boards. The final lamination of the board layers, the defect of this type of process is that at least two laminations are required, and the graphics between each layer are easy to shift, which increases the process, production cycle and cost
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] The present invention will be further described below in conjunction with specific examples.
[0033] A lamination process of a multi-layer rigid-flex board with a thickened photosensitive film comprises the following steps:
[0034] a. Take the prefabricated first soft board 1, the first soft board 1 includes the first soft board layer 1.1, the first upper copper foil layer 1.2, the first lower copper foil layer 1.3, the first upper cover film 1.4 and The first lower cover film 1.5; on the upper surface of the first soft board layer 1.1, there are five first upper copper foil layers 1.2 arranged at left and right intervals, and five pieces are arranged on the lower surface of the first soft board layer 1.1. The first lower copper foil layer 1.3 arranged at intervals, the first upper copper foil layer 1.2 in the middle is wrapped with a first upper cover film 1.4, and the first lower copper foil layer 1.3 in the middle is wrapped with a first lower cover Membrane 1.5; ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a lamination technology of a multilayer soft and hard combined plate with thickened light sensitive films. The technology comprises the following steps that first and second soft plates are taken and pressed with the light sensitive films, the first light sensitive film beyond a first upper coverage film contour is removed, the second light sensitive film beyond a second upper coverage film contour is removed, the lower surface of a first lower coverage film in the first light sensitive soft plate is coated with a glue by brushing, and first and second hard plates, a prepreg and fifth and sixth copper foil layers are taken, stacked according to sequence and molded by lamination. According to the invention, the light sensitive films, the coverage films and pure glue are coupled randomly to a thickness close to that of the prepreg, the flatness of plates before lamination is ensured, a lamination flow of the multilayer soft plate is omitted, offset of each layer of patterns is controlled, the flow and production period are reduced, and the cost is reduced.
Description
technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a lamination process of a multi-layer soft-hard combination board with thickened photosensitive film. Background technique [0002] With the development trend of thinner, integrated and multi-functional consumer electronic products, the requirements for the production process of printed circuit-flex-rigid boards are getting higher and higher. In line with this trend, the printed circuit flex-rigid board of the multilayer flexible board will gradually become an important part of the printed circuit board. The advantages of this product are that it can save more design space, reduce assembly, and signal transmission faster and faster. stable etc. [0003] There are two kinds of stacked structures for the flexible and rigid boards of multi-layer flexible boards. One is that the bent part of the flexible board is only protected by a cover film, a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K3/46
CPCH05K3/361H05K3/4611H05K3/4626H05K2203/066
Inventor 华福德
Owner 高德(江苏)电子科技股份有限公司