Chip grabbing device and vertical type rotary multi-head packaging equipment

Abstract

The invention discloses a chip grabbing device. The chip grabbing device comprises a rotary motor, a grabbing rotary disc, grabbing heads, an R-direction external positioning device and a Z-directionexternal positioning device; the rotary motor is connected with the grabbing rotary disc to drive the grabbing device to rotate; a plurality of grabbing heads are slidably connected to the grabbing rotating disc in the radial direction; the R-direction external positioning device is connected with the grabbing heads so as to drive the grabbing heads to rotate around the axis of the grabbing rotarydisc; and the Z-direction external positioning device is connected with the grabbing heads so as to drive the grabbing heads to slide on the grabbing rotary disc in the radial direction. By virtue ofthe chip grabbing device, the defects of low rotary angle precision of the grabbing head of a multi-head-grabbing chip grabbing device and high load of the multiple grabbing heads with a high precision rotary angle in the prior art can be overcome, so that the working efficiency of the chip packaging is improved, the loads of the grabbing heads are reduced, and the packaging precision of a chip product is guaranteed.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip grabbing device and vertical rotary multi-head packaging equipment. Background technique [0002] Semiconductor chips are widely used in daily life. Single-head packaging technology is generally used for packaging and processing. At present, the packaging technology is often packaged on the first layer of chips and substrates. The packaging method uses the chip to face down and face the substrate, without wire bonds. Combined, metal balls are used to form the shortest circuit, thereby reducing the resistance, reducing the size of the package, improving the electrical performance, and solving the problem of increasing the size of the BGA in order to increase the number of pins. Since the WAFER wafer device and the PANEL (or lead) device are on the same plane, in order to ensure no interference between the two structures, the gripping part needs to move in a large ran...

AI Technical Summary

Problems solved by technology

Since the WAFER wafer device and the PANEL (or lead) device are on the same plane, in order to ensure no interference between the two structures, the gripping part needs to move in a large range. The chip gripping device provided by the traditional technology has a moving range of the gripping part. It is large, and taking pictures, taking photos and recognizing, and sticking films are serial work, which has the disadvantage of time-consuming and labor-intensive, therefore, resulting in low work efficiency

The existing chip grabbing device adds multi-head grabbing components on the basis of the traditional chip grabbing device. However, the rotation angle accuracy of the grabbing head of the multi-head chip grabbing device in the prior art is greater than ±3°, Therefore, the chip grabbing device with multi-head grabbing in the prior art cannot guarantee the accuracy of the product, while the multi-grabbing head that can realize the high-precision corner function will increase the load of the grabbing head and affect the rotation speed of the multi-grabbing head

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