Detection method for binding effect of FOB products
A detection method and product technology, applied in measuring devices, material analysis by optical means, instruments, etc., can solve the problem of inability to effectively detect the bonding effect, and achieve the effect of simple bonding effect, high accuracy and high efficiency.
Inactive Publication Date: 2019-04-16
SHENZHEN JUNDA OPTOELECTRONICS
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Problems solved by technology
To solve the technical problem that the existing method of detecting the bonding effect of FOB products needs to tear off the FPC for observation or the bonding effect cannot be effectively detected even if the FPC is torn off
Method used
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[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0023] Based on the defect that the existing FOB product bonding effect detection method needs to tear off the FPC, an embodiment of the present invention provides a FOB product bonding effect detection method. The technological process of the detection method of described FOB product bonding effect is as follows figure 2 As shown, it includes the following steps:
[0024] S01: Form the FOB bonding structure;
[0025] S02: Perform thermal compression bonding on the FOB bonding structure;
[0026] S03: Using a microscope objective lens to observe the indentation...
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Abstract
The invention discloses a detection method for a binding effect of FOB products. The detection method comprises the steps of forming an FOB binding structure, and carrying out hot pressing binding treatment on the FOB binding structure; and observing the indentation on the surface, which is away from a printed circuit board, of a flexible circuit board by adopting a microscope objective to judge the effect of the hot pressing binding treatment. According to the detection method, the binding effect of the FOB binding structure is directly judged through observing the indentation characteristicsof the outer surface of the flexible circuit board, so that the binding effect of the FOB products is enabled to be simply detected and judged, and the efficiency is high. In addition, the detectionaccuracy is ensured to be high, thereby effectively avoiding the defect that the FPC needs to be torn off for observation so as to detect the binding effect of the FOB products or that the binding effect still cannot be effectively detected even though the FPC is torn off.
Description
technical field [0001] The invention belongs to the technical field of electronic processing, in particular to a method for detecting the bonding effect of FOB products. Background technique [0002] In the field of electronics industry, bonding technology is widely used. For example, in fields with high requirements for electromagnetic shielding (such as military industry), electromagnetic shielding treatment is required for display devices. One of the more common methods is to coat the outside of the display panel with an adhesive layer, and then bond a layer with a conductive layer. On the one hand, the substrate plays the role of electromagnetic shielding, and on the other hand, it can strengthen the panel to play the role of hanging impact. In the multi-module optoelectronic device (or integrated circuit) integration process, multiple modules are first arranged precisely, then the substrate or module is coated with an adhesive layer, and then multiple modules and the s...
Claims
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Login to View More IPC IPC(8): G01N21/84
CPCG01N21/84
Inventor 周治国雷洋黎美锋王令
Owner SHENZHEN JUNDA OPTOELECTRONICS