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Process variation power control in three-dimensional (3D) integrated circuits (ICS) (3DICS)

An integrated circuit, 3D technology, applied in the direction of voltage/temperature change compensation, circuits, electrical pulse generator circuits, etc., can solve problems such as increasing manufacturing costs and discarding

Inactive Publication Date: 2019-04-16
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such unusable layers may be discarded, which increases manufacturing costs

Method used

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  • Process variation power control in three-dimensional (3D) integrated circuits (ICS) (3DICS)
  • Process variation power control in three-dimensional (3D) integrated circuits (ICS) (3DICS)
  • Process variation power control in three-dimensional (3D) integrated circuits (ICS) (3DICS)

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Embodiment Construction

[0018] Referring now to the drawings, several exemplary aspects of the disclosure are described. The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects.

[0019] Aspects disclosed in the detailed description include systems and methods for process varying power control in three-dimensional (3D) integrated circuits (ICs) (3DICs). In an exemplary aspect, at least one process change sensor is placed in each layer of the 3DIC. The process variation sensors report information about velocity characteristics of elements within the respective layers to decision logic. The decision logic is programmed to weight outputs from the process variation sensors according to the relative importance of logical path segments in the respective layers. The weighted outputs are combined to generate a power control signal sent to a p...

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Abstract

Systems and methods for process variation power control in three- dimensional integrated circuits, 3DICs, are disclosed. In an exemplary aspect, at least one process variation sensor (324, 326) is placed in each tier (302) of a 3DIC (300). The process variation sensors report information related to a speed characteristic for elements within the respective tier to a decision logic (328). The decision logic is programmed to weight output from the process variation sensors according to relative importance of logic path segments (310, 320) in the respective tiers. The weighted outputs are combinedto generate a power control signal that is sent to a power management unit (PMU). By weighting the importance of the logic path segments, a compromise voltage may be generated by the PMU which is ''good enough'' for all the elements in the various tiers to provide acceptable performance.

Description

[0001] priority application [0002] This application requires the application titled "PROCESS VARIATION POWER CONTROL IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs)" filed on September 14, 2016 (3DICs))”, the contents of which are incorporated herein by reference in their entirety. technical field [0003] The techniques of this disclosure relate generally to power control, and more specifically, to power control in three-dimensional (3D) integrated circuits (ICs) (3DICs). Background technique [0004] Computing devices have become ubiquitous in modern society. The increase in the number of computing devices is due in part to the advent of truly portable or mobile computing devices. While such mobile computing devices began as relatively heavy and bulky devices that drained batteries relatively quickly, increased miniaturization and power saving techniques have turned current devices into powerful multimedia devices with extensive functionality and often adequate ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K19/003H01L27/06H03K3/03
CPCH01L2224/14181H01L2224/16145H01L2224/16146H01L2224/32145H01L2224/48145H01L2224/73207H01L2224/73265H03K19/00369H03K3/0315H01L2924/00
Inventor 吉比·萨姆森蒲宇杜杨
Owner QUALCOMM INC